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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

Ask the Experts Member

Steve Pollock

Vice President
Essemtec USA

Steven Pollock has worked in the industry for OEMs, and large CMs before moving to application Sales. Pollock has been working in SMT industry for nearly 20 years.

Steve Pollock has submitted responses to the following questions.

Manual or Automated Assembly?
I would recommend a small prototype line. ...

Education Level Prior to IPC Certification
That would be a good test, but some people just have a knack for soldering. ...

Lead Free Reflow Oven Zone Count
It depends on the volume you need and size of PCB. ESSEMTEC offers a 4 zone lead free oven that ...

Hand Solder vs. Wave Solder
The deciding factor is volume of production. Things to consider with wave soldering...Cost of machine Cost of 300-900 lbs of ...

Batch Reflow vs. In-line Reflow
I have 13 years of experience selling batch and inline ovens. Batch ovens have their place. Smaller simple PCB, but ...

APEX Trade Show Feedback
You missed a much busier show then last year, at least for ESSEMTEC. We unveiled a new pick and place ...

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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated