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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Simon Smith
Marketing Manager
Pillarhouse International Ltd
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Mr. Smith has been in the electronics industry for over 30 years, the last 21 in the Selective Soldering field. He has progressed from electronics design, through after sales and now marketing.
Simon Smith has submitted responses to the following questions.
Mixing Different SAC305 Solders
In theory yes you can mix suppliers, however we have had issues where compliant SAC305 actually had various 'anti-dross' agents ...
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