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Depaneling machine for separating circuit boards
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
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Ask the Experts Member

Simon Smith

Marketing Manager
Pillarhouse International Ltd

Mr. Smith has been in the electronics industry for over 30 years, the last 21 in the Selective Soldering field. He has progressed from electronics design, through after sales and now marketing.

Simon Smith has submitted responses to the following questions.

Point to Pint Soldering vs Drag Soldering
From your description it sounds like you are hand-soldering rather than using a form of selective soldering method. One thing ...

Mixing Different SAC305 Solders
In theory yes you can mix suppliers, however we have had issues where compliant SAC305 actually had various 'anti-dross' agents ...

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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
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