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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Ask the Experts Member |
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Simon Smith
Marketing Manager
Pillarhouse International Ltd
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Mr. Smith has been in the electronics industry for over 30 years, the last 21 in the Selective Soldering field. He has progressed from electronics design, through after sales and now marketing.
Simon Smith has submitted responses to the following questions.
Mixing Different SAC305 Solders
In theory yes you can mix suppliers, however we have had issues where compliant SAC305 actually had various 'anti-dross' agents ...
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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