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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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Ask the Experts Member |
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Brian Bauer
Business Manager
Heraeus Incorporated
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Mr. Bauer has been in the SMT industry since 1982. He has been involved with the development, manufacture and technical support for the full range of Heraeus SMT products, including adhesives, conductive adhesives, fluxes and solder paste.
Brian Bauer has submitted responses to the following questions.
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