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Your Partner for All Inspection Tasks
AOI from Viscom for the Best Cycle times and Maximum Inspection Depth. See 3D AXI, 3D AOI and 3D MXI at IPC APEX EXPO. Visit booth 2820. March 18-20.
Viscom

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Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center

Ask the Experts Member

Brian Bauer

Business Manager
Heraeus Incorporated

Mr. Bauer has been in the SMT industry since 1982. He has been involved with the development, manufacture and technical support for the full range of Heraeus SMT products, including adhesives, conductive adhesives, fluxes and solder paste.

Brian Bauer has submitted responses to the following questions.

What is the Shelf Life for a Syringe of Solder Paste
The shelf life of the solder paste is established by the Manufacturer based on their internal studies. The expiration date ...

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Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder

TLPS is proven for outstanding reliabiility #2