circuitnet
Sponsor
Summit-Interconnect

Webinar on 10/30 at 11:00 AM PT
Free Webinar: Learn what's new in the IPC-6012 Space Addendum featuring key updates, best design practices, and reliability.
Summit Interconnect
Glenbrook-Technologies
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Ask the Experts Member

INDEX
ASK
PANEL
JOIN
image

Brian Bauer


Business Manager
Heraeus Incorporated

Mr. Bauer has been in the SMT industry since 1982. He has been involved with the development, manufacture and technical support for the full range of Heraeus SMT products, including adhesives, conductive adhesives, fluxes and solder paste.

Brian Bauer has submitted responses to the following questions.
What is the Shelf Life for a Syringe of Solder Paste
The shelf life of the solder paste is established by the Manufacturer based on their internal studies. The expiration date ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
SEIKA-America