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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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Carson Orud

Carson Orud

SmartDRY Product Manager
ECD
Product Manager for SmartDRY intelligent dry storage cabinets at Electronic Controls Design with background in calibration and service. Degreed in Instrumentation.

Carson Orud has submitted responses to the following questions.
Question About Dry Storage of PCBA's
Just to clarify – dry cabinets will not actively dry out a component which has already absorbed moisture, unless they ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling