Circuitnet Ask the Experts

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Ask the Experts Index

■	How To Reduce Solder Joint Voids in QFN Components
■	Reduce Glare During Assembly
■	How To Rework SMT Connector with Center Ground Strip
■	Two Year Component Date Code Mandate
■	IPC SOIC Defect Question
■	OA Flux Turning Blue
■	Conformal Coating Over No-Clean Flux
■	Copper Dissolution Rate
■	Matte Black Solder Mask Defects
■	BGA Solder Ball Collapse
■	ESD Ground Wire Gauge
■	Conformal Coating Press Fit Connectors
■	Recommended Fiducial Shape
■	PCBA Inspection Process Causing Damage
■	Can a Few Contaminated Joints Cause an Assembly to Fail RoHS Compliance?
■	Ultrasonic Cleaning and Surfactants
■	Low Operating Temperature Lead-Free Solder
■	BGA Reballing Question
■	Requirement for Toe Fillets
■	EMI Shield Reflow Soldering Techniques
■	Part Movement During Reflow
■	BGA re-balled with lead free spheres
■	Testing Hand Soldering Skills
■	How Many Fiducials Per Solder Paste Stencil?
■	Solder Alloy Investigation
■	Reliability Concerns When Converting to Lead-free
■	Contamination Using Solvent Dispensers
■	Mixed Process Solder Joint Appearance, Smooth or Grainy?
■	What Caused SMT Pads to Oxidize After Reflow
■	Viscosity of Solder Paste Before Printing
■	Solder Splashing During Wave Soldering
■	ENIG Solderability Issues
■	Solder Paste Mixing
■	Recommended Solder Paste Aperture Configuration
■	Polyurethane Conformal and Acrylic Coating on the Same PCB
■	Conformal Coating in Nitrogen Environment
■	Double Sided Reflow for Micro BGA Components
■	Baking After Cleaning Hand Placed Parts
■	Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
■	Coils Rotated After Reflow
■	Stencil Pattern for Thermal Pads on QFNs
■	Component Shifting
■	What Is Causing Connectors to Bow?
■	Cleaning No-Clean Solder Paste
■	Solder Paste Alloy Check
■	Challenge Wetting Solder to Brass Pins
■	Class 3 Cleaning Requirements
■	Mixing Different SAC305 Solders
■	Rework of Underfilled Array Packages
■	What Causes Solder Balls During Rework?

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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura