Circuitnet Ask the Experts

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Ask the Experts Index

■	QFN Open Solder Joints
■	BGA Component Grounding Problem
■	Solder Mask Ghosting
■	Is Component Lead Damage Reparable?
■	Challenges with 01005 Components
■	Components Jumping Around During Reflow
■	Moisture Barrier Bag Calculation
■	Acceptable Conductor Repair
■	Question About Dry Storage of PCBA's
■	MELF Component Misalignment
■	Delamination After V-cut
■	Allowable Bow and Twist on Round PC Fab
■	Is There a Spec for LDI Mask thickness?
■	Production Floor Temperature and Humidity Loggers
■	How To Reduce Solder Joint Voids in QFN Components
■	Reduce Glare During Assembly
■	How To Rework SMT Connector with Center Ground Strip
■	Two Year Component Date Code Mandate
■	IPC SOIC Defect Question
■	OA Flux Turning Blue
■	Conformal Coating Over No-Clean Flux
■	Copper Dissolution Rate
■	Matte Black Solder Mask Defects
■	BGA Solder Ball Collapse
■	ESD Ground Wire Gauge
■	Conformal Coating Press Fit Connectors
■	Recommended Fiducial Shape
■	PCBA Inspection Process Causing Damage
■	Can a Few Contaminated Joints Cause an Assembly to Fail RoHS Compliance?
■	Ultrasonic Cleaning and Surfactants
■	Low Operating Temperature Lead-Free Solder
■	BGA Reballing Question
■	Requirement for Toe Fillets
■	EMI Shield Reflow Soldering Techniques
■	Part Movement During Reflow
■	BGA re-balled with lead free spheres
■	Testing Hand Soldering Skills
■	How Many Fiducials Per Solder Paste Stencil?
■	Solder Alloy Investigation
■	Reliability Concerns When Converting to Lead-free
■	Contamination Using Solvent Dispensers
■	Mixed Process Solder Joint Appearance, Smooth or Grainy?
■	What Caused SMT Pads to Oxidize After Reflow
■	Viscosity of Solder Paste Before Printing
■	Solder Splashing During Wave Soldering
■	ENIG Solderability Issues
■	Solder Paste Mixing
■	Recommended Solder Paste Aperture Configuration
■	Polyurethane Conformal and Acrylic Coating on the Same PCB
■	Conformal Coating in Nitrogen Environment

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
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The Essential Guide for High-Reliability BGA Component Re-balling