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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom

Ask the Experts Index

■	Is There a Spec for LDI Mask thickness?
■	Production Floor Temperature and Humidity Loggers
■	How To Reduce Solder Joint Voids in QFN Components
■	Reduce Glare During Assembly
■	How To Rework SMT Connector with Center Ground Strip
■	Two Year Component Date Code Mandate
■	IPC SOIC Defect Question
■	OA Flux Turning Blue
■	Conformal Coating Over No-Clean Flux
■	Copper Dissolution Rate
■	Matte Black Solder Mask Defects
■	BGA Solder Ball Collapse
■	ESD Ground Wire Gauge
■	Conformal Coating Press Fit Connectors
■	Recommended Fiducial Shape
■	PCBA Inspection Process Causing Damage
■	Can a Few Contaminated Joints Cause an Assembly to Fail RoHS Compliance?
■	Ultrasonic Cleaning and Surfactants
■	Low Operating Temperature Lead-Free Solder
■	BGA Reballing Question
■	Requirement for Toe Fillets
■	EMI Shield Reflow Soldering Techniques
■	Part Movement During Reflow
■	BGA re-balled with lead free spheres
■	Testing Hand Soldering Skills
■	How Many Fiducials Per Solder Paste Stencil?
■	Solder Alloy Investigation
■	Reliability Concerns When Converting to Lead-free
■	Contamination Using Solvent Dispensers
■	Mixed Process Solder Joint Appearance, Smooth or Grainy?
■	What Caused SMT Pads to Oxidize After Reflow
■	Viscosity of Solder Paste Before Printing
■	Solder Splashing During Wave Soldering
■	ENIG Solderability Issues
■	Solder Paste Mixing
■	Recommended Solder Paste Aperture Configuration
■	Polyurethane Conformal and Acrylic Coating on the Same PCB
■	Conformal Coating in Nitrogen Environment
■	Double Sided Reflow for Micro BGA Components
■	Baking After Cleaning Hand Placed Parts
■	Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
■	Coils Rotated After Reflow
■	Stencil Pattern for Thermal Pads on QFNs
■	Component Shifting
■	What Is Causing Connectors to Bow?
■	Cleaning No-Clean Solder Paste
■	Solder Paste Alloy Check
■	Challenge Wetting Solder to Brass Pins
■	Class 3 Cleaning Requirements
■	Mixing Different SAC305 Solders

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp