|
Sponsor
|
|
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
|
|
|
Sponsor
|
|
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
|
|
| Ask the Experts |
|
QUESTIONS
SUBMIT
MEMBERS
JOIN
|
July 16, 2026 - Updated
December 1, 2021 - Originally Posted
Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Can anyone explain why there is no Space and Military addendum for IPC-6013, as available for IPC-6012 and IPC-6018, considering that flex and flex-rigid PCBs are used in space and military equipment?
P.O.
|
| Expert Panel Responses |
We have been using class 3 for space and military for a very long time and have not seen any issues with flex and rigid flex that requires a separate specification.
Manfred Maehl
President, SMT North America, Inc.
Manfred Maehl has been active in the electronics industry for almost 20 years. His latest assignment is the introduction of Europe's leading reflow oven manufacturer SMT, Wertheim to the North American market.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
|
|
|