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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
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Ask the Experts Member |
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Manfred Maehl
President
SMT North America, Inc.
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Manfred Maehl has been active in the electronics industry for almost 20 years. His latest assignment is the introduction of Europe's leading reflow oven manufacturer SMT, Wertheim to the North American market.
Manfred Maehl has submitted responses to the following questions.
Question About IPC-6013
We have been using class 3 for space and military for a very long time and have not seen any ...
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Thermally Conductive, Low Outgassing Epoxy
Master Bond EP21AOLV-2LO is an electrically insulating adhesive that meets NASA low outgassing requirements for sealing, coating and encapsulation applications. Ask an expert.
Master Bond
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