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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Ask the Experts Member |
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Manfred Maehl
President
SMT North America, Inc.
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Manfred Maehl has been active in the electronics industry for almost 20 years. His latest assignment is the introduction of Europe's leading reflow oven manufacturer SMT, Wertheim to the North American market.
Manfred Maehl has submitted responses to the following questions.
Question About IPC-6013
We have been using class 3 for space and military for a very long time and have not seen any ...
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