| Sponsor |
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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| Sponsor |
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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| Ask the Experts |
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September 16, 2024 - Updated
December 1, 2021 - Originally Posted
Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Can anyone explain why there is no Space and Military addendum for IPC-6013, as available for IPC-6012 and IPC-6018, considering that flex and flex-rigid PCBs are used in space and military equipment?
P.O.
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| Expert Panel Responses |
We have been using class 3 for space and military for a very long time and have not seen any issues with flex and rigid flex that requires a separate specification.
Manfred Maehl
President
SMT North America, Inc.
Manfred Maehl has been active in the electronics industry for almost 20 years. His latest assignment is the introduction of Europe's leading reflow oven manufacturer SMT, Wertheim to the North American market.
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