| Sponsor |
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Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
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| Sponsor |
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Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.
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| Ask the Experts |
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September 16, 2024 - Updated
December 1, 2021 - Originally Posted
Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Can anyone explain why there is no Space and Military addendum for IPC-6013, as available for IPC-6012 and IPC-6018, considering that flex and flex-rigid PCBs are used in space and military equipment?
P.O.
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| Expert Panel Responses |
We have been using class 3 for space and military for a very long time and have not seen any issues with flex and rigid flex that requires a separate specification.
Manfred Maehl
President
SMT North America, Inc.
Manfred Maehl has been active in the electronics industry for almost 20 years. His latest assignment is the introduction of Europe's leading reflow oven manufacturer SMT, Wertheim to the North American market.
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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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