circuitnet
Sponsor
Glenbrook-Technologies

Probe Card Manufacturer 'Sees the Unseen' With X-ray
Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
Glenbrook Technologies
kyzen
Sponsor
ECD

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
Ask the Experts
INDEX
ASK
PANEL
JOIN
COMMENT
SEARCH
September 16, 2024 - Updated
December 1, 2021 - Originally Posted

Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards



Can anyone explain why there is no Space and Military addendum for IPC-6013, as available for IPC-6012 and IPC-6018, considering that flex and flex-rigid PCBs are used in space and military equipment?

P.O.

Expert Panel Responses

We have been using class 3 for space and military for a very long time and have not seen any issues with flex and rigid flex that requires a separate specification.

image
Manfred Maehl
President
SMT North America, Inc.
Manfred Maehl has been active in the electronics industry for almost 20 years. His latest assignment is the introduction of Europe's leading reflow oven manufacturer SMT, Wertheim to the North American market.
Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
Master-Bond