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July 24, 2026 - Updated December 8, 2016 - Originally Posted Recommended Solder Paste Aperture Configuration
What aperture shape/configuration do you recommend with our solder paste stencils for 008004 and 01005 pad sizes?
T.G.
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A 15% reduction on the pad size and 2 mil stencil worked for the applications that I have done. The used shape for the aperture is the classic square.
Engineering and Operations Management, Independent Consultant
Georgian Simion is an independent consultant with 20+ years in electronics manufacturing engineering and operations Contact me at georgiansimion@yahoo.com.
I will follow the manufacturer's recommended pad shape. However, when dealing with such small components, your solder type and stencil release will be the key players in your process.
Senior Manufacturing Engineer, Northrop Grumman
Edithel is a chemical engineer with 20 year experience in manufacturing & process development for electronic contract manufacturers in US as well as some major OEM's. Involved in SMT, Reflow, Wave and other assembly operations entailing conformal coating and robotics.
Unfortunately there is not an industry standard for these smaller components at this time. Several big name users have developed and optimized their own pad stack that works best for them.For the stencil, I would recommend something in the .003" (75 micron) range for a thickness and nanocoating is a must. The aperture can then be 1 to 1 with the pad.
Technical Support Engineer, Indium Corporation
Kay Parker is a Technical Support Engineer based at Indium Corporation's headquarters in Clinton, N.Y. In this role she provides guidance and recommendations to customers related to process steps, equipment, techniques, and materials. She is also responsible for servicing the company's existing accounts and retaining new business.
008004 .004 x .005 oblong with .003 space01005 .005 x .006 oblong with .004 space
Vice President Technology, Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
Successful ultra-fine pitch printing as required for 008004 and 01005 components pushes the boundaries of current paste, stencil and equipment technologies. Multiple input variables need to be optimized to achieve the desired result. Chief amongst these are solder paste, stencil materials and aperture designs. Extensive print testing indicates that a 'squircle' aperture (a square with a radius corner) consistently outperforms either a round or square aperture.
Director of Product Management, AIM
Timothy O'Neill is the Director of Product Management for AIM Solder. AIM Solder is a leading global manufacturer of assembly materials for the electronics industry. Mr. O’Neill has 25 years of industry experience is a Certified IPC Specialist. Mr. O’Neill’s responsibilities include developing product and technical information; he is a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA.
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