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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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Robert Freid

Robert Freid

President and Founder
Contract Manufacturing Consultants, Inc.
Robert Fried helps leading electronics OEM's develop world-class sourcing strategies for PCBA, cables, precision metals, plastics, modules and complete end-products. Other service areas are supplier risk assessment, comprehensive outsource ...

Robert Freid has submitted responses to the following questions.
Full Aqueous Clean or Local Spot Clean
It depends on the extent of the rework. If the rework is done to a single component, hand cleaning is ...
How To Remove Oxidation On SMT Components
This is a challenging problem. It depends on the qty of parts and cost. You can apply a more active ...
BGA Reballing Question
I have not seen this method of removing excess solder prior to reballing but the use of flux sprayed to ...
BGA Solder Ball Collapse
Need to be careful in answering this question. Lots of variables to consider such as BGA pitch, solder mask openings, ...
What Is Causing Slanted Pins After Reflow
It sounds like the thin PCB is bowing slightly during reflow. Have them check to see if the pins bowing ...
Tough Hand Soldering Problem
If they can determine the metals to be soldered, thediameter of the wire to solder and the type of wire ...
Dam & Fill vs. Conformal Coating
Yes the Dam & Fill provides mechanical support to ensure proper acceptable fillets. Conformal coating is use as moisture resistant ...
Through Hole Connector Solder Joint Hole Fill
For class III solder fillet in the past use people to inspect joints using magnifying lights or microscope. Today CM's ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling