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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Peter Vigneau

Peter Vigneau

Vice President
Mr. Vigneau has been a key member of the team at Circuit Technology Center since 2008. He has vast expertise, experience and understanding of complex circuit board rework, repair and modification operations. He is one of the most knowledgeable experts in this area across the globe.

Peter Vigneau has submitted responses to the following questions.
Question About Dry Storage of PCBA's
It sure sounds like you are concerned about unwanted moisture entrapment within your potted assemblies, a legitimate concern relative to ...
ESD Ground Wire Gauge
In answer to your question, as detailed in the book "ESD From A to Z Second Edition" by John M. ...
How To Rework SMT Connector with Center Ground Strip
We perform this type of repair on a regular basis. There are several important variables to be considered prior to ...
Options for Reballing BGA Components
The appropriatere-balling process to follow is dependent on the BGA package. If you are re-balling a eutectic or lead-free BGA ...
Rework or Repair?
In response to the second of your two questions, are there clear definitions for the terms repair and rework? Yes, ...
Hand Soldering Alternative
One product that might solve your problem is AMP-BARREL terminals offered by Tyco Electronics. The AMP-BARREL Terminal is designed to ...
Can You Rework Circuits Under a BGA
Absolutely, it is possible to rework and add circuits under leadless devices like BGA's while maintaining the ever critical flatness ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling