circuitnet
Sponsor
Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Plasma Etch
Sponsor
KYZEN
A Collaborative Model for Hands-On Electronics Manufacturing Education
KYZEN Corporation and the Rochester Institute of Technology (RIT) have established an academic-industry collaboration to integrate real-world electronics manufacturing challenges directly into engineering education.
KYZEN
Ask the Experts Member
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
Peter Vigneau

Peter Vigneau

Vice President
Mr. Vigneau has been a key member of the team at Circuit Technology Center since 2008. He has vast expertise, experience and understanding of complex circuit board rework, repair and modification operations. He is one of the most knowledgeable experts in this area across the globe.

Peter Vigneau has submitted responses to the following questions.
Question About Dry Storage of PCBA's
It sure sounds like you are concerned about unwanted moisture entrapment within your potted assemblies, a legitimate concern relative to ...
ESD Ground Wire Gauge
In answer to your question, as detailed in the book "ESD From A to Z Second Edition" by John M. ...
How To Rework SMT Connector with Center Ground Strip
We perform this type of repair on a regular basis. There are several important variables to be considered prior to ...
Options for Reballing BGA Components
The appropriatere-balling process to follow is dependent on the BGA package. If you are re-balling a eutectic or lead-free BGA ...
Rework or Repair?
In response to the second of your two questions, are there clear definitions for the terms repair and rework? Yes, ...
Hand Soldering Alternative
One product that might solve your problem is AMP-BARREL terminals offered by Tyco Electronics. The AMP-BARREL Terminal is designed to ...
Can You Rework Circuits Under a BGA
Absolutely, it is possible to rework and add circuits under leadless devices like BGA's while maintaining the ever critical flatness ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Circuitnet Media LLC
Reflow Soldering Oven Survey
We invite you to participate in this important survey about Reflow Soldering Ovens. This survey is anonymous, and your personal data is not collected. Click to begin survey.
Circuitnet Media LLC
Peel-A-Way Removable Terminal Carriers