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Brianna Anderson


Senior Process Engineer
Circuit Technology Center

Brianna is a Senior Process Engineer with experience in the Medical, Semiconductor, and Aerospace & Defense industries. Proven expertise in developing and optimizing manufacturing processes while ensuring compliance with industry standards such as MIL-STD, J-STD, and IPC. Skilled in process validation, lean manufacturing, and quality improvement initiatives.

Brianna Anderson has submitted responses to the following questions.
Solder Ball Wrinkles
A combination of items could cause Wrinkles with solder ball appearance post reflowCooling to quickly from liquid state to solid ...
Solder Alloy Investigation
XRF (X-ray Fluorescence) equipment can provide detailed composition results without harm to the product. Circuit Technology Center, Inc in Haverhill ...
How To Remove Oxidation On SMT Components
I recommend removing the oxidation on the leads before installation using a Robotic Hot Solder Tinning service. A mildly activated ...
Coils Rotated After Reflow
Possibly a high center point under the device. Verify that the device sits flat and favors the leads contacting on ...
Moisture Barrier Bag Calculation
Please use J-STD-033 for calculations. The calculations is not based on the collapsed bag, but the bag volume regardless of ...
Acceptability Standard for Plated Hole Barrel Fill
J-STD-001 is the exact guidance for your requirements and will answer all of your questions. ...
SOT (Small Outline Transistor) Body Cracks
Not knowing the process and where the cracking occurs. Check your pick and place force if using an automated machine. ...
Pin-in-Paste Hole Stencil Printing
If you have a positive pressure squeegee head (self dispensing) you might get away with slowing the travel or pausing ...
Seeking IPC and J-STD Definitions
A Body seal is a lidded device and the seal can be of many forms. Welds, Epoxies and other forms ...
Challenge Wetting Solder to Brass Pins
Have you tried superior 75 flux? If not, this might be the solution. Following the manufacturer guidelines is strongly recommended. ...
Step Stencil Squeegee Angle
If using a Stainless Steel squeegee blade then a 45° angle should work. If using a polymer squeegee blade several ...
Mixed MSL Baking
Bake to the higher MSL device/Board listed. The reason is the board and surrounding components most likely will see higher ...
How to Remove Oxidization from SMT Component Leads?
There are ways to remove oxidation from SMT components if they are not mounted or attached to other hardware. Circuit ...
Considering Plasma Cleaning
Plasma can be described as the 4th state of matter consisting of atoms, ions, radicals and electrons. Conceptually to create ...
How To Measure Solder Paste Rolling Diameter
Please see the link below and this may help with your question as it is a common one. However, please ...
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
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