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Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
kyzen
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Viscom-SE

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
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John De Leeuw


Manufacturing Process Engineer
TE SubCom

John has more than thirty years of precision metal fabrication, contract manufacturing, fiber optics and electronic manufacturing experience in quality and production management and process engineering capacities. He has been a Certified IPC Trainer for more than ten years. He is currently a Manufacturing Process Engineer for High Reliability Optoelectronic assemblies used in undersea fiber optic cable systems.

John De Leeuw has submitted responses to the following questions.
Question About ESD Ionizer Guns
Air blown or drawn by vacuum over board surfaces can generate considerable static charge. IPC-A-610 identifies compressed air as a ...
Solder Joint Blow Holes
Without clearance between the component and the destination side land of the PTH, this phenomenon is possible and even more ...
Challenge Wetting Solder to Brass Pins
I would expect brass to be an unlikely material for connector pin, since it is typically hard to solder to. ...
Point to Pint Soldering vs Drag Soldering
In my experience, drag soldering with a slant chisel or "hoof" tip is strictly a surface mount technique. I would ...
Exposed Copper Defect
Basically, so long as exposed copper or basis metal is not part of the required solder fillet area or the ...
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Zestron

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas
Uyemura