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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Mark Frimann
Product Stewardship Management
Texas Instruments
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Mark Frimann has been working in electronic industry regulations and standards on chemical and material restrictions, and how this is dealt with in the supply chain, and addressing on-going issues as these requirements change and become further defined.
Mark Frimann has submitted responses to the following questions.
Bromine Free PWBs
I am not a PWB expert but the low halogen push is from NGOs (nongovernment organizations) push to remove the ...
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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