Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Mark Frimann

Product Stewardship Management

Texas Instruments

Mark Frimann has been working in electronic industry regulations and standards on chemical and material restrictions, and how this is dealt with in the supply chain, and addressing on-going issues as these requirements change and become further defined.

Mark Frimann has submitted responses to the following questions.

Bromine Free PWBs
I am not a PWB expert but the low halogen push is from NGOs (nongovernment organizations) push to remove the ...

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling