Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Michael Sivigny

General Manager

CeTaQ Americas

As General Manager at CeTaQ Americas, Michael has grown the company from scratch in the Americas market since 2001. The CeTaQ global brand is known for 3rd party objective measurement solutions. Michael lives in Manchester, NH with his family.

Michael Sivigny has submitted responses to the following questions.

SOT (Small Outline Transistor) Body Cracks
An often overlooked but very important quality parameter in the placement process is placement force. Too much force during touch ...

Pick and Place Machine Calibration
CeTaQ's global independent Cpk measurement service has measured over 20,000 SMT machines in nearly 25 years. All types, all OEM's, ...

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling