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Underfill Epoxy Offers Thermal Conductivity
Master Bond EP29LPTCHT is a low viscosity adhesive that can be used for underfill & encapsulation apps. It offers thermal conductivity & electrical insulation.
Master Bond
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Ask the Experts Member |
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Michael Sivigny
General Manager
CeTaQ Americas
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As General Manager at CeTaQ Americas, Michael has grown the company from scratch in the Americas market since 2001. The CeTaQ global brand is known for 3rd party objective measurement solutions. Michael lives in Manchester, NH with his family.
Michael Sivigny has submitted responses to the following questions.
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