|Ask the Experts Member|
NASA/Marshall Space Flight Center
Garry McGuire is a manufacturing process engineer and Chair of the IPC J-STD-001 and IPC/WHMA A-620 Space Addendum committees.
Wire Tinning Dispute
NASA-STD-8739.4 says thattinning all the way to the insulation is preferred, but it is acceptable forthere to be a gap. ...
Fastening Surface Mounted Connectors Before or After Refow?
Always torque before soldering! If you torque after soldering, there will undoubtedly be some movement of the connector which will ...
White Discoloration After Ultrasonic Cleaning
We do not use the soldering materials/process that you do, so I can't add value to your question. However, I ...
Acceptable Conductor Repair
IPC 7711/7721, Rework, Repair and Modification of Electronic Assemblies, is an incredible resource for recommended rework and repair practices. The ...
Soldering Multilayer Ceramic Chip Capacitors
Preheating the assembly is a must (local to the area being worked is okay ... the entire assembly need not ...
The heel fillet requirement has its history in MIL-STD-2000 andprevious versions of military and NASA standards and has been verified ...
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