circuitnet
Sponsor
Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
kyzen
Sponsor
Viscom-SE

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom SE

Ask the Experts Member

INDEX
ASK
PANEL
JOIN
image

Garry McGuire


Sr. Engineer
NASA/Marshall Space Flight Center

Garry McGuire is a manufacturing process engineer and Chair of the IPC J-STD-001 and IPC/WHMA A-620 Space Addendum committees.

Garry McGuire has submitted responses to the following questions.
Polyurethane Conformal and Acrylic Coating on the Same PCB
We have successfully touched up acrylic coating with urethane. If there are compatible in that direction, I'm sure it will ...
Wire Tinning Dispute
NASA-STD-8739.4 says thattinning all the way to the insulation is preferred, but it is acceptable forthere to be a gap. ...
Fastening Surface Mounted Connectors Before or After Refow?
Always torque before soldering! If you torque after soldering, there will undoubtedly be some movement of the connector which will ...
White Discoloration After Ultrasonic Cleaning
We do not use the soldering materials/process that you do, so I can't add value to your question. However, I ...
Acceptable Conductor Repair
IPC 7711/7721, Rework, Repair and Modification of Electronic Assemblies, is an incredible resource for recommended rework and repair practices. The ...
Soldering Multilayer Ceramic Chip Capacitors
Preheating the assembly is a must (local to the area being worked is okay ... the entire assembly need not ...
IPC-A-610 Criteria
The heel fillet requirement has its history in MIL-STD-2000 and previous versions of military and NASA standards and has been ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Zestron

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas
Uyemura