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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Garry McGuire

Garry McGuire

Sr. Engineer
NASA/Marshall Space Flight Center
Garry McGuire is a manufacturing process engineer and Chair of the IPC J-STD-001 and IPC/WHMA A-620 Space Addendum committees.

Garry McGuire has submitted responses to the following questions.
Polyurethane Conformal and Acrylic Coating on the Same PCB
We have successfully touched up acrylic coating with urethane. If there are compatible in that direction, I'm sure it will ...
Wire Tinning Dispute
NASA-STD-8739.4 says thattinning all the way to the insulation is preferred, but it is acceptable forthere to be a gap. ...
White Discoloration After Ultrasonic Cleaning
We do not use the soldering materials/process that you do, so I can't add value to your question. However, I ...
Fastening Surface Mounted Connectors Before or After Refow?
Always torque before soldering! If you torque after soldering, there will undoubtedly be some movement of the connector which will ...
Acceptable Conductor Repair
IPC 7711/7721, Rework, Repair and Modification of Electronic Assemblies, is an incredible resource for recommended rework and repair practices. The ...
IPC-A-610 Criteria
The heel fillet requirement has its history in MIL-STD-2000 and previous versions of military and NASA standards and has been ...
Soldering Multilayer Ceramic Chip Capacitors
Preheating the assembly is a must (local to the area being worked is okay ... the entire assembly need not ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
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The Essential Guide for High-Reliability BGA Component Re-balling