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Neil O'Brien

Sales Director
Finetech

Neil O'Brien has worked in the field of electronic manufacturing equipment for over fifteen years and is currently Sales Director for Finetech, a manufacturer of precision rework systems and die bonders.

Neil O'Brien has submitted responses to the following questions.

Hot Air Soldering for 0201s and 01005s
Rather than investing in a new machine, also consider inducing N2 if you are using a convection rework system. When ...

Chip Bonder Certification
Shear testing will give you anidea of the strength of the connection, but certainly other machine specifictests should be looked ...

Rework of Underfilled Array Packages
Before attempting underfill rework, I recommend you contact the underfill supplier and find out if the material is truly "reworkable". ...

Package-on-Package Rework
Yes the top package (memory) for a PoP device can be removed separately from the bottom. To be successful with ...

Cleaning Reballed BGA Components
Over the years of selling our reballing mini-oven, we have seen others using ultrasonic cleaners. The one caution is your ...

Small chip cap rework advise
Without a doubt, there are two main issues regarding small passive component rework. First, can you see them? Not just ...

Reworked BGA component bridging at the corners
From your line of questioning, you are pointing toward the warp being purely in the BGA. The board can be ...

Socket Rework Challenge
Board warpage is avoidable ... if a PCB can enter and exit a reflow oven without warping, the same should ...

Component Rework Limit
Most customers will consider the thermal cycles of the PCB and component in question. Based on the PCB material integrity, ...

Recommended Rework Dwell Times
Dwell time on a reworked component is usually based directly on the dwell time targeted during the production process (your ...

BGA Replacement limit
1. A lot of our customers will count the thermal cycles of the PCB. And based on the PCB material ...

Pre-Bake Standard for Rework
The pre-bake consideration is also dependent on the components residing on the board. You can check the various IPC standards ...

Solder to a thin flexible circuit
Defining solder attach for flex circuit is quite common. There are a couple of tricky issues that need to be ...

BGA Rework - with or without solder paste
There is an advantage to applying a fresh solder paste print, after BGA removal on a PCB. Afterall, this better ...

BGA re-balling process
Much will depend upon how many spheres need to be placed or replaced. Assuming that the component (for example BGA, ...

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