| Sponsor |
|
iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
|
|
| Sponsor |
|
Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
|
|
| Ask the Experts |
|
|
June 3, 2014 - Updated
May 29, 2014 - Originally Posted
Chip Bonder Certification
We are planning to certify a new chip bonder supplier. We plan to do a shear test and compare the results with our the current chip bonder. What other approval tests should we perform?
M.N.
|
| Expert Panel Responses |
Shear testing will give you anidea of the strength of the connection, but certainly other machine specifictests should be looked at. Whether the bonder is automated or manual,placement accuracy tests are important.
We always verify our bonders usingglass verniers to prove placement accuracy. Automated bonders willnormally have a method of capturing that data. Manual equipment may require adifferent test - such as a Gauge R&R using multiple operators. This willprovide a standard deviation from operator to operator using the sameequipment.
In addition, thermal tests shouldbe considered. Depending on your chemistry, there will likely be top and/orbottom heat, controlled force and other process parameters as well (ultrasonic,dispense, etc). Validating desired settings vs. actual settings such astemperature, force and dispense volume could prove vital to your future yield.
Lastly, long term testingis worth the time and expense to ensure that a new machine does not have anyongoing detrimental effects on a product’s quality. An example of thiswould be accelerated life cycle testing.
Neil O'Brien
Sales Director
Finetech
Neil O'Brien has worked in the field of electronic manufacturing equipment for over fifteen years and is currently Sales Director for Finetech, a manufacturer of precision rework systems and die bonders.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
|
|
|
