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June 3, 2014

Chip Bonder Certification

We are planning to certify a new chip bonder supplier. We plan to do a shear test and compare the results with our the current chip bonder. What other approval tests should we perform?

M.N.

Experts Comments

Shear testing will give you an idea of the strength of the connection, but certainly other machine specific tests should be looked at.  Whether the bonder is automated or manual, placement accuracy tests are important.     

We always verify our bonders using glass verniers to prove placement accuracy.  Automated bonders will normally have a method of capturing that data. Manual equipment may require a different test - such as a Gauge R&R using multiple operators. This will provide a standard deviation from operator to operator using the same equipment.   

In addition, thermal tests should be considered. Depending on your chemistry, there will likely be top and/or bottom heat, controlled force and other process parameters as well (ultrasonic, dispense, etc). Validating desired settings vs. actual settings such as temperature, force and dispense volume could prove vital to your future yield.    

Lastly, long term testing is worth the time and expense to ensure that a new machine does not have any ongoing detrimental effects on a productís quality.  An example of this would be accelerated life cycle testing.
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Neil O'Brien
Sales Director
Finetech
Neil O'Brien has worked in the field of electronic manufacturing equipment for over fifteen years and is currently Sales Director for Finetech, a manufacturer of precision rework systems and die bonders.
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