Brian O'Leary

Global Account Manager

Indium Corporation

Mr. O'Leary is the Global Account Manager for Indium. He has and extensive global network of contacts in the electronics industry with expertise in SMT equipment and processes.

Brian O'Leary has submitted responses to the following questions.

Lead Free Reflow Oven Zone Count
Short answer, greater number of zones give you greater control over your process. Let's not forget, the purpose of a ...

Board Spacing During Reflow
Idon't know whether or not spacing will have an impact on energy savingsand I am certain you will find the ...

Lead-Free Profile Using Leaded Paste
PCBs with a mix of tin-lead and lead free components or high mass and low mass components has a similar ...

Need for Reflow Profiles
Many of my KIC customers do exactly what you are suggesting. Here is how it is done: Step 1 - ...

What Is the Life Span for a Profile Board?
P.V. you are way ahead of the game for using an actual product, which has been argued on this forum ...

Issues with BGA Components Near PCB Edges
At least on the reflow front, you can use profiling as a tool to ensure you are reaching the correct ...

Low Silver Soldering Problems
I represent KIC, maker of thermal profiling equipment and software. I spend most of my time on reflow since there ...

What Causes SMT Component Shift?
Not all reflow ovens are created equal. Also, if you take perhaps the best most controlled oven on the market ...

How to predict possible intermetallics
The formation of intermetallics depends on the elements in the solder alloy composition, the surface finish of the PCB pads ...

Reflow oven testing and calibrating concern
The short answer to your question is no. There is no industry standard test board. Test boards, also sometimes called ...

BGA Replacement Limit
I totally agree with Mark McMeens' assertion below that often manufacturers only get as few as two attempts to get ...