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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Ask the Experts Member |
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David Whalley
Senior Lecturer
Loughborough University
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Mr. Whalley has over 30 years of experience as a R&D professional within the electronics manufacturing sector, both in industry and academia, and is the author of more than 200 publications. His main areas of expertise are in joining processes and materials, particularly electrically conductive adhesives and soldering processes and their monitoring and control. He is also experienced in electronics thermal management and additive manufacturing processes for electronic interconnects.
David Whalley has submitted responses to the following questions.
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