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AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.

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Optically Clear Nanosilica Filled Epoxy
Master Bond EP4NS-80 is a low viscosity epoxy for bonding and sealing that possesses excellent dimensional stability, low CTE and minimal shrinkage upon curing.
Master Bond

Ask the Experts Member

David Whalley

Senior Lecturer
Loughborough University

Mr. Whalley has over 30 years of experience as a R&D professional within the electronics manufacturing sector, both in industry and academia, and is the author of more than 200 publications. His main areas of expertise are in joining processes and materials, particularly electrically conductive adhesives and soldering processes and their monitoring and control. He is also experienced in electronics thermal management and additive manufacturing processes for electronic interconnects.

David Whalley has submitted responses to the following questions.

Critical Part Fixture During Reflow
I don't have any experience with the use of fixtures for this, but the obvious concern if using a conventional ...

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Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN