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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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UNDI Fabrication for IC Substrates
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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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David Whalley

David Whalley

Senior Lecturer
Loughborough University
Mr. Whalley has over 30 years of experience as a R&D professional within the electronics manufacturing sector, both in industry and academia, and is the author of more than 200 publications. His main areas of expertise are in joining processes and materials, particularly electrically conductive adhesives and soldering processes and their monitoring and control. He is also experienced in electronics thermal management and additive manufacturing processes for electronic interconnects.

David Whalley has submitted responses to the following questions.
Critical Part Fixture During Reflow
I don't have any experience with the use of fixtures for this, but the obvious concern if using a conventional ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling