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Your Partner for All Inspection Tasks
AOI from Viscom for the Best Cycle times and Maximum Inspection Depth. See 3D AXI, 3D AOI and 3D MXI at IPC APEX EXPO. Visit booth 2820. March 18-20.
Viscom

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Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center

Ask the Experts Member

Gustavo Arredondo

Technical Manager
Para Tech Coating, Inc.

Gustavo Arredondo is currently Technical Manager for Para Tech Coating, Inc. He has 18+ years in parylene conformal coating and product development. Para Tech strives to be the provider of choice for Parylene coating products and services.

Gustavo Arredondo has submitted responses to the following questions.

Specific Solder To Control Dendritic Growth
The dendritic growth is is a serious problems that is often addressed with defluxing of the PCB. A change in ...

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Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder

TLPS is proven for outstanding reliabiility #2