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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Ask the Experts Member |
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Gustavo Arredondo
Technical Manager
Para Tech Coating, Inc.
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Gustavo Arredondo is currently Technical Manager for Para Tech Coating, Inc. He has 18+ years in parylene conformal coating and product development. Para Tech strives to be the provider of choice for Parylene coating products and services.
Gustavo Arredondo has submitted responses to the following questions.
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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