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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Ask the Experts Member |
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Patinya Srianan
Customer Technical Support Engineer
Alpha Assembly Solution
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Mr. Srianan is a Customer Technical Support Engineer for Alpha Assembly Solution. He has 15-years of experience in SMT and soldering fields. He takes care of all technical inquiries and problems for customers in Southeast Asia and Australia.
Patinya Srianan has submitted responses to the following questions.
Solder Paste Print Test Boards
Using the real boards to perform test print to simulate the setup and parameters. The problem can be detected before ...
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