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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Ask the Experts Member |
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Patinya Srianan
Customer Technical Support Engineer
Alpha Assembly Solution
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Mr. Srianan is a Customer Technical Support Engineer for Alpha Assembly Solution. He has 15-years of experience in SMT and soldering fields. He takes care of all technical inquiries and problems for customers in Southeast Asia and Australia.
Patinya Srianan has submitted responses to the following questions.
Solder Paste Print Test Boards
Using the real boards to perform test print to simulate the setup and parameters. The problem can be detected before ...
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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