Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Patinya Srianan

Customer Technical Support Engineer

Alpha Assembly Solution

Mr. Srianan is a Customer Technical Support Engineer for Alpha Assembly Solution. He has 15-years of experience in SMT and soldering fields. He takes care of all technical inquiries and problems for customers in Southeast Asia and Australia.

Patinya Srianan has submitted responses to the following questions.

Solder Paste Print Test Boards
Using the real boards to perform test print to simulate the setup and parameters. The problem can be detected before ...

Full Aqueous Clean or Local Spot Clean
Water-soluble solder paste is mostly classified in ORH0 or ORH1 which are highly corrosive. Manual cleaning is a risk to ...

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling