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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Emmanuelle Guene
Application Manager
Inventec Performance Chemicals
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Emmanuelle Guene began her career as an R&D Technician with Promosol, which later became Inventec Performance Chemicals, France. Upon obtaining her Masters of Chemistry degree in Organic Synthesis from CNAM in Paris in 2003, Emmanuelle became a Development Engineer where she has been involved in formulating leading edge solder pastes and fluxes as well as providing training and technical support to customers worldwide. Since 2011, she is worldwide Application Manager.
Emmanuelle Guene has submitted responses to the following questions.
Stencil Cleaning Procedure
The use of IPA remains common because it is cheap, has an acceptable efficiency and evaporates fast. Its flammability has ...
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