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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Emmanuelle Guene

Emmanuelle Guene

Application Manager
Inventec Performance Chemicals
Emmanuelle Guene began her career as an R&D Technician with Promosol, which later became Inventec Performance Chemicals, France. Upon obtaining her Masters of Chemistry degree in Organic Synthesis from CNAM in Paris in 2003, Emmanuelle became a Development Engineer where she has been involved in formulating leading edge solder pastes and fluxes as well as providing training and technical support to customers worldwide. Since 2011, she is worldwide Application Manager.

Emmanuelle Guene has submitted responses to the following questions.
Stencil Cleaning Procedure
The use of IPA remains common because it is cheap, has an acceptable efficiency and evaporates fast. Its flammability has ...
Mixing Different SAC305 Solders
First, I would recommend you to check the certificate of conformity (CoC) or the certificate of analysis (CoA) of the ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling