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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Emmanuelle Guene
Application Manager
Inventec Performance Chemicals
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Emmanuelle Guene began her career as an R&D Technician with Promosol, which later became Inventec Performance Chemicals, France. Upon obtaining her Masters of Chemistry degree in Organic Synthesis from CNAM in Paris in 2003, Emmanuelle became a Development Engineer where she has been involved in formulating leading edge solder pastes and fluxes as well as providing training and technical support to customers worldwide. Since 2011, she is worldwide Application Manager.
Emmanuelle Guene has submitted responses to the following questions.
Stencil Cleaning Procedure
The use of IPA remains common because it is cheap, has an acceptable efficiency and evaporates fast. Its flammability has ...
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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