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A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
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Dr. Eyal Weiss


CTO
Cybord

Electronic and Mechanical Engineer with 25 years experience in technology development. CTO of Cybord, developing electronic component authentication technology using deep-tech visual inspection and big-data. Author of a book and 24 papers.

Dr. Eyal Weiss has submitted responses to the following questions.
Process Controls When Running Multiple Lines
When multiple lines build the same assembly, it helps to separate the discussion into materials and process. Materials: Even when ...
Stencil Pattern for LGA Power Pad
It’s a good idea to divide the large ground pad into smaller stencil openings. A single large opening often traps ...
Solder Ball Wrinkles
Wrinkles on the surface of solder balls during reflow can arise due to various factors, primarily related to the soldering ...
Solder Paste Stencil Inactivity
The safe duration of leaving solder paste on a stencil without wiping or cleaning can vary depending on the type ...
Storage To Prevent Corrosion
Both nitrogen storage and super-dry storage can be effective in preventing the corrosion of electronic components and printed circuit boards ...
Baking Old PCBs Prior To Reflow
The life span of a PCB is not only about the exposure to humidity, and not everything can be solved ...
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
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