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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Dr. Eyal Weiss

Dr. Eyal Weiss

CTO
Cybord
Electronic and Mechanical Engineer with 25 years experience in technology development. CTO of Cybord, developing electronic component authentication technology using deep-tech visual inspection and big-data. Author of a book and 24 papers.

Dr. Eyal Weiss has submitted responses to the following questions.
Process Controls When Running Multiple Lines
When multiple lines build the same assembly, it helps to separate the discussion into materials and process. Materials: Even when ...
Stencil Pattern for LGA Power Pad
It’s a good idea to divide the large ground pad into smaller stencil openings. A single large opening often traps ...
Solder Ball Wrinkles
Wrinkles on the surface of solder balls during reflow can arise due to various factors, primarily related to the soldering ...
Storage To Prevent Corrosion
Both nitrogen storage and super-dry storage can be effective in preventing the corrosion of electronic components and printed circuit boards ...
Solder Paste Stencil Inactivity
The safe duration of leaving solder paste on a stencil without wiping or cleaning can vary depending on the type ...
Baking Old PCBs Prior To Reflow
The life span of a PCB is not only about the exposure to humidity, and not everything can be solved ...
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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
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The Essential Guide for High-Reliability BGA Component Re-balling