Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Paul Wood

Advanced Applications Manager

OK International

Mr. Wood has been with OK International for 35 years and has been involved in the design of all rework products. He is a global expert in circuit board and electronics rework and has travel world wide supporting customer applications .

Paul Wood has submitted responses to the following questions.

Reflow Oven - 5 Zone or 8 Zone
Difference between 5 and 8 zones ovens. I do understand as I have been involved in design of smaller ovens ...

Moisture Sensitive Components in Flooded Storage Facility
Component use after plant is flooded and parts are over the 60 RH limit for 36-48 hours is usually the ...

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling