Sponsor

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.

Sponsor

Optically Clear Nanosilica Filled Epoxy
Master Bond EP4NS-80 is a low viscosity epoxy for bonding and sealing that possesses excellent dimensional stability, low CTE and minimal shrinkage upon curing.
Master Bond

Ask the Experts Member

Paul Wood

Advanced Applications Manager
OK International

Mr. Wood has been with OK International for 35 years and has been involved in the design of all rework products. He is a global expert in circuit board and electronics rework and has travel world wide supporting customer applications .

Paul Wood has submitted responses to the following questions.

Reflow Oven - 5 Zone or 8 Zone
Difference between 5 and 8 zones ovens. I do understand as I have been involved in design of smaller ovens ...

Moisture Sensitive Components in Flooded Storage Facility
Component use after plant is flooded and parts are over the 60 RH limit for 36-48 hours is usually the ...

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Sponsor

Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN