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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process  especially those with vacuum  is challenging. ECD's M-VP sealed barrier can take it. Learn more.
ECD

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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch

Ask the Experts Member

Paul Wood

Advanced Applications Manager

OK International

Mr. Wood has been with OK International for 35 years and has been involved in the design of all rework products. He is a global expert in circuit board and electronics rework and has travel world wide supporting customer applications .

Paul Wood has submitted responses to the following questions.

Reflow Oven - 5 Zone or 8 Zone
Difference between 5 and 8 zones ovens. I do understand as I have been involved in design of smaller ovens ...

Moisture Sensitive Components in Flooded Storage Facility
Component use after plant is flooded and parts are over the 60 RH limit for 36-48 hours is usually the ...

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Removal/Milling of Underfilled Parts: AVX1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering

TLPS is proven for outstanding reliabiility #1