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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
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Ask the Experts Member |
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Paul Wood
Advanced Applications Manager
OK International
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Mr. Wood has been with OK International for 35 years and has been involved in the design of all rework products. He is a global expert in circuit board and electronics rework and has travel world wide supporting customer applications .
Paul Wood has submitted responses to the following questions.
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