circuitnet
Sponsor
Master Bond
Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
UNDI Fabrication for IC Substrates
Sponsor
KYZEN
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN
Ask the Experts Member
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
Chris Ellis

Chris Ellis

Sales Manager
Manncorp
Chris Ellis is a Sales Manager/Engineer for Manncorp with 19+ years experience in the PCB assembly equipment industry. Chris worked as a Manufacturing Engineer for 5 Years. Prior to going into sales, he was with PCB assembly equipment suppliers. Before joining Manncorp, Chris was an independent rep in the Carolinas for several years.

Chris Ellis has submitted responses to the following questions.
0201 Pick & Place Nozzle Plugging
I would not go right to the .004" stencil since this is reducing globally. I would actually go to a ...
Pick and Place Placement Rate
A typical good rule is to derate the placement rate by 40% for real time environment. If they are stating ...
Mixed Technology - Which First
You could potentially run the through hole first. However, you should read the specs on the components beforehand. Many through-hole ...
Solder Paste Mixing After Storage
This is actually the preferred and recommended solution for all paste we sell.
Lead Free Reflow Oven Zone Count
For the most part it really depends on your board density, type of material etc. Assuming it is just a ...
Should we buy new low cost assembly equipment?
It almost goes without saying that the "cons" of buying Chinese-made equipment should be offset by dealing with a reputable ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling