|Ask the Experts Member|
Fuji America Corporation
Scott Wischoffer has been in the SMT industry since 1986 with experience in service, training, sales & applications, and marketing.
How Many Fiducials Per Solder Paste Stencil?
Any more than two marks on the stencil is a waste. Unlike a PCB, a stencil cannot be stretched or ...
Why Should We Consider Smart Feeders?
The simple answer is QUALITY! By bar-coding the component reels and scanning them after they are loaded onto the feeder, ...
Pick Performance for SMT Placement Machines
A world class pick-up rate on an SMT placement machine would be 99.95% or better.Current testing on the latest 03015, ...
Pick and Place Placement Rate
Ask each machine manufacturer your looking at to run a cycle time analysis using your products, it's best to have ...
Is Rework Unacceptable?
At Fuji Machine we have customers that build to the "0" Defect standard. Using great equipment and tools like electrical ...
Chip Component Cracking During Placement
Your question raises so many more questions. First, can you trace the cracked components to a specific product, area of ...
Pick and Place Board Deflection
Probably not! Although there are many variables in the behavior of solder joints including: manufacture of solder paste, material make ...
Concerns Using Hand Sanitizers
Yes there are some issues with Hand Sanitizers. Hand Sanitizers are made with Glycerin. Glycerin is considered a "contaminate" for ...
Component Clearance Specification
Realistically the smallest spacing between components will be about 0.15mm. Even though a machine might be rated to place better ...
Need for SMT adhesives
Double sided boards have been around since the beginning of SMT. In the early days, most SMT lines had a ...
Laser alignment vs. vision centering for Pick & Place
Good Question, but difficult to answer because it depends on what you want to do. Laser systems work by rotating ...
Keep package in place during reflow
You have already answered your own question. Placing a small amount of adhesive under the body of the component, will ...
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