|Ask the Experts|
October 8, 2007
Keep package in place during reflow
I have a build-to-print job that requires LEDs and photodiodes in clear SOT23 packages to be precisely placed on the board in all three dimensions. Currently when the boards go through the reflow oven the photodiode packages float on the solder and end up 10 to 15 mils up off the board. Is there a method to keep them in place and in contact with the board as they go through the oven? We do not have a glue machine.
|Expert Panel Responses|
You have already answered your own question. Placing a small amount of adhesive under the body of the component, will secure it to the substrate prior to reflow and insure the X, Y and Z position does not change. Most surface mount adhesives cure around 100 degrees c, this is just before the flux in the solder paste becomes active and well before the metal becomes liquid, insuring the component will not move during reflow. Adding a glue machine to the line is one option, however, many placement machines today also have adhesive dispensing capabilities precisely for this reason. Machines that have dispensing options include, the Fuji NXT and Fuji XPF placement systems.
Fuji America Corporation
The only way to secure them is with an adhesive. While you mention you do not have a glue machine, you can purchase a hand dispenser for SMT adhesive for well under $400.00USD. Once the parts are secured, you will be able to solder them without movement. If you prefer not to glue them, you can hand solder them post reflow.
Regional Sales Manager
OK International Inc.
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