circuitnet
Sponsor
Master Bond
Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
UNDI Fabrication for IC Substrates
Sponsor
KYZEN
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN
Ask the Experts Member
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
Robert Boguski

Robert Boguski

President
Datest
Robert has 40 years of service in PCB and electronic system design, fabrication and assembly, test, and engineering, including X-ray/CT scanning for nondestructive failure analysis. He is on the SMTA Board of Directors and a columnist for Circuits Assembly Magazine.

Robert Boguski has submitted responses to the following questions.
Design Considerations and Impact on Assembly
An oft-overlooked consideration is testing. This states the obvious, but failure to incorporate testing access into board designs has a ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling