Sponsor

Viscom at SMTA Michigan & Ohio
Join Viscom at SMTA Michigan (8/18/26) and Ohio (8/20/26) to discover the latest advancements in AOI and AXI inspection technology, including our powerful AI solutions.
Viscom SE

Sponsor

High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering

Ask the Experts Member

Robert Boguski

President
Datest

Robert has 40 years of service in PCB and electronic system design, fabrication and assembly, test, and engineering, including X-ray/CT scanning for nondestructive failure analysis. He is on the SMTA Board of Directors and a columnist for Circuits Assembly Magazine.

Robert Boguski has submitted responses to the following questions.

Design Considerations and Impact on Assembly
An oft-overlooked consideration is testing. This states the obvious, but failure to incorporate testing access into board designs has a ...

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Sponsor

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies