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Robert Boguski


President
Datest

Robert has 40 years of service in PCB and electronic system design, fabrication and assembly, test, and engineering, including X-ray/CT scanning for nondestructive failure analysis. He is on the SMTA Board of Directors and a columnist for Circuits Assembly Magazine.

Robert Boguski has submitted responses to the following questions.
Design Considerations and Impact on Assembly
An oft-overlooked consideration is testing. This states the obvious, but failure to incorporate testing access into board designs has a ...
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Electrically Conductive Die Attach Epoxy
Master Bond EP17HTS-DA is a silver filled, die attach adhesive that withstands high temperatures and passes MIL-STD-883J thermal stability requirements.
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