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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process especially those with vacuum is challenging. ECD's M-VP sealed barrier can take it. Learn more.
ECD
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Robert Boguski
President
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Robert has 40 years of service in PCB and electronic system design, fabrication and assembly, test, and engineering, including X-ray/CT scanning for nondestructive failure analysis. He is on the SMTA Board of Directors and a columnist for Circuits Assembly Magazine.
Robert Boguski has submitted responses to the following questions.
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