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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Robert Boguski
President
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Robert has 40 years of service in PCB and electronic system design, fabrication and assembly, test, and engineering, including X-ray/CT scanning for nondestructive failure analysis. He is on the SMTA Board of Directors and a columnist for Circuits Assembly Magazine.
Robert Boguski has submitted responses to the following questions.
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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