Sponsor

Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN

Sponsor

Reinforce Critical Components on PCBs
UV-curable, low-modulus ruggedizing adhesives secure BGAs/VGAs, improving shock & vibration resistance of electronic assemblies. Low-outgassing version available.
Dymax

Ask the Experts Member

David Suihkonen

President
R&D Technical Services Inc.

David is President at R&D Technical Services, a vapor phase reflow oven manufacturer. he has 20 plus years experience in the vapor phase reflow industry.

David Suihkonen has submitted responses to the following questions.

What Causes Solder Balls During Rework?
As to solder balls during reflow, you may find you need a bit more solder conditioning via preheat before processing ...

Black Land Edges
Couple of questions.Does the black material clean off? What type of preheat are you using?Solder and flux type?I'd be happy ...

Intermittent BGA Test Problems
It sounds as though you're not getting proper wetting of the solder under the BGA. If I had to guess, ...

How many zones are adequate for lead free profile
I guess you are assuming the use of convection reflow for your lead free application when you mention "how many ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®.
Plasmatreat GmbH