Sponsor

Probe Card Manufacturer 'Sees the Unseen' With X-ray
Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
Glenbrook Technologies

Sponsor

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD

Ask the Experts Member

David Suihkonen

President
R&D Technical Services Inc.

David is President at R&D Technical Services, a vapor phase reflow oven manufacturer. he has 20 plus years experience in the vapor phase reflow industry.

David Suihkonen has submitted responses to the following questions.

What Causes Solder Balls During Rework?
As to solder balls during reflow, you may find you need a bit more solder conditioning via preheat before processing ...

Black Land Edges
Couple of questions.Does the black material clean off? What type of preheat are you using?Solder and flux type?I'd be happy ...

Intermittent BGA Test Problems
It sounds as though you're not getting proper wetting of the solder under the BGA. If I had to guess, ...

How many zones are adequate for lead free profile
I guess you are assuming the use of convection reflow for your lead free application when you mention "how many ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS