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Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology

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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS

Ask the Experts Member

David Suihkonen

President
R&D Technical Services Inc.

David is President at R&D Technical Services, a vapor phase reflow oven manufacturer. he has 20 plus years experience in the vapor phase reflow industry.

David Suihkonen has submitted responses to the following questions.

What Causes Solder Balls During Rework?
As to solder balls during reflow, you may find you need a bit more solder conditioning via preheat before processing ...

Black Land Edges
Couple of questions.Does the black material clean off? What type of preheat are you using?Solder and flux type?I'd be happy ...

Intermittent BGA Test Problems
It sounds as though you're not getting proper wetting of the solder under the BGA. If I had to guess, ...

How many zones are adequate for lead free profile
I guess you are assuming the use of convection reflow for your lead free application when you mention "how many ...

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura