Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process  especially those with vacuum  is challenging. ECD's M-VP sealed barrier can take it. Learn more.
ECD

Sponsor

3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch

Ask the Experts Member

David Suihkonen

President

R&D Technical Services Inc.

David is President at R&D Technical Services, a vapor phase reflow oven manufacturer. he has 20 plus years experience in the vapor phase reflow industry.

David Suihkonen has submitted responses to the following questions.

What Causes Solder Balls During Rework?
As to solder balls during reflow, you may find you need a bit more solder conditioning via preheat before processing ...

Black Land Edges
Couple of questions.Does the black material clean off? What type of preheat are you using?Solder and flux type?I'd be happy ...

Intermittent BGA Test Problems
It sounds as though you're not getting proper wetting of the solder under the BGA. If I had to guess, ...

How Many Zones Needed for a Lead-free Profile?
I guess you are assuming the use of convection reflow for your lead free application when you mention "how many ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Removal/Milling of Underfilled Parts: AVX1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering

TLPS is proven for outstanding reliabiility #1