Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

David Suihkonen

President

R&D Technical Services Inc.

David is President at R&D Technical Services, a vapor phase reflow oven manufacturer. he has 20 plus years experience in the vapor phase reflow industry.

David Suihkonen has submitted responses to the following questions.

What Causes Solder Balls During Rework?
As to solder balls during reflow, you may find you need a bit more solder conditioning via preheat before processing ...

Black Land Edges
Couple of questions.Does the black material clean off? What type of preheat are you using?Solder and flux type?I'd be happy ...

Intermittent BGA Test Problems
It sounds as though you're not getting proper wetting of the solder under the BGA. If I had to guess, ...

How Many Zones Needed for a Lead-free Profile?
I guess you are assuming the use of convection reflow for your lead free application when you mention "how many ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling