circuitnet
Sponsor
Master Bond
Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
UNDI Fabrication for IC Substrates
Sponsor
KYZEN
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN
Ask the Experts Member
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
Mahesh V Draksharapu

Mahesh V Draksharapu

Independent Consultant
Over 28 years experience in the area of PCB assembly with 10 years working in various EMS companies in the US (Avex, GSS Array Technology now Benchmark, Everex computer Systems), 10 years working in OEM companies in the US (Trillium Test Systems, Intel & Meru Networks) and with Aristos EMS company in Bangalore since 2008. Engineering Degree from BIT, Mesra and Masters in Egg Mgmt from Wichita State University.

Mahesh V Draksharapu has submitted responses to the following questions.
Reflow Oven - 5 Zone or 8 Zone
In the SMT process the 2 main pieces of equipment which have over 90% affect on the quality of a ...
Insufficient Barrel Fill on Through-hole Components
In my personal opinion it should not make a difference between Leaded vs ROHS solder, however there are the following ...
Viscosity of Solder Paste Before Printing
Solder paste material is a mixture of solder powder, flux and various additives that improve the rheology and other characteristics. ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling