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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation
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Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
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Ask the Experts Member |
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Mahesh V Draksharapu
Independent Consultant
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Over 28 years experience in the area of PCB assembly with 10 years working in various EMS companies in the US (Avex, GSS Array Technology now Benchmark, Everex computer Systems), 10 years working in OEM companies in the US (Trillium Test Systems, Intel & Meru Networks) and with Aristos EMS company in Bangalore since 2008. Engineering Degree from BIT, Mesra and Masters in Egg Mgmt from Wichita State University.
Mahesh V Draksharapu has submitted responses to the following questions.
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