Sponsor

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

Sponsor

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Ask the Experts Member

Mahesh V Draksharapu

Independent Consultant

Over 28 years experience in the area of PCB assembly with 10 years working in various EMS companies in the US (Avex, GSS Array Technology now Benchmark, Everex computer Systems), 10 years working in OEM companies in the US (Trillium Test Systems, Intel & Meru Networks) and with Aristos EMS company in Bangalore since 2008. Engineering Degree from BIT, Mesra and Masters in Egg Mgmt from Wichita State University.

Mahesh V Draksharapu has submitted responses to the following questions.

Reflow Oven - 5 Zone or 8 Zone
In the SMT process the 2 main pieces of equipment which have over 90% affect on the quality of a ...

Insufficient Barrel Fill on Through-hole Components
In my personal opinion it should not make a difference between Leaded vs ROHS solder, however there are the following ...

Viscosity of Solder Paste Before Printing
Solder paste material is a mixture of solder powder, flux and various additives that improve the rheology and other characteristics. ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.