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Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
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Plasma-Etch
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Circuit-Technology-Center

Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
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Jeff Ferry


President
Circuit Technology Center, Inc.

Mr. Ferry is President of Circuit Technology Center, a world-leading contractor for the repair and rework of assembled circuit boards founded in 1983. Jeff also serves as Publisher of Circuitnet and Semiconductor Packaging News.

Jeff Ferry has submitted responses to the following questions.
Repair Teflon coated PCB's
Sorry to say I'm not familiar with any specs on Teflon board repair. As a long-time member of the IPC ...
Soldering wire on through-hole pad
Not sure if I wouild call it a standard, I think it may be more of a guideline. See some ...
Jumper wire guidelines
There is an excellent guide on the Circuit Technology Center website. Visit the following pages for details: http://www.circuitrework.com/guides/6-1.html http://www.circuitrework.com/guides/6-3.html ...
Remove and replace a 240 pin connector
Multip pin connectors can be a bear to remove. I'm sure we would use a solder fountain to tackle such ...
Aqueous Cleaning Process
We routinely use isopropyl alcohol for simple bench top cleaning during repair and rework. IPC has a somewhat involved procedure ...
Repair lifted/damaged pads on Teflon substrates
Teflon is a bit more difficult to bond a replacement pads to, but certainly can be done. We have a ...
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Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
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Ormet TLPS
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