circuitnet
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
Advanced-Interconnections
Sponsor
Circuit-Technology-Center

Reduce Electronics Costs with Strategic Component Recovery
Recovering valuable electronic components can help manufacturers lower expenses, minimize waste, and extend the life of critical inventory. Learn practical methods.
Circuit Technology Center
Ask the Experts
INDEX
ASK
PANEL
JOIN
COMMENT
SEARCH
October 9, 2006 - Updated
July 4, 2007 - Originally Posted

Repair damaged pads on Teflon Substrates



Is there a repair method out there for repairing lifted/damaged pads on Teflon substrates?

Michelle Elston

Expert Panel Responses

Teflon is a bit more difficult to bond a replacement pads to, but certainly can be done. We have a procedure online you may wish to take a look at. See our online procedure 4.7.2 Surface Mount Pad Repair, Film Adhesive Method.

image
Jeff Ferry
President
Circuit Technology Center, Inc.
Mr. Ferry is President of Circuit Technology Center, a world-leading contractor for the repair and rework of assembled circuit boards founded in 1983. Jeff also serves as Publisher of Circuitnet and Semiconductor Packaging News.
Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Intraratio-Corporation

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio
SEHO