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Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
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Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.
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| Ask the Experts |
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October 9, 2006 - Updated
July 4, 2007 - Originally Posted
Repair damaged pads on Teflon Substrates
Is there a repair method out there for repairing lifted/damaged pads on Teflon substrates?
Michelle Elston
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| Expert Panel Responses |
Teflon is a bit more difficult to bond a replacement pads to, but certainly can be done. We have a procedure online you may wish to take a look at. See our online procedure 4.7.2 Surface Mount Pad Repair, Film Adhesive Method.
Jeff Ferry
President
Circuit Technology Center, Inc.
Mr. Ferry is President of Circuit Technology Center, a world-leading contractor for the repair and rework of assembled circuit boards founded in 1983. Jeff also serves as Publisher of Circuitnet and Semiconductor Packaging News.
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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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