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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
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| Ask the Experts |
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October 9, 2006 - Updated
July 4, 2007 - Originally Posted
Repair damaged pads on Teflon Substrates
Is there a repair method out there for repairing lifted/damaged pads on Teflon substrates?
Michelle Elston
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| Expert Panel Responses |
Teflon is a bit more difficult to bond a replacement pads to, but certainly can be done. We have a procedure online you may wish to take a look at. See our online procedure 4.7.2 Surface Mount Pad Repair, Film Adhesive Method.
Jeff Ferry
President
Circuit Technology Center, Inc.
Mr. Ferry is President of Circuit Technology Center, a world-leading contractor for the repair and rework of assembled circuit boards founded in 1983. Jeff also serves as Publisher of Circuitnet and Semiconductor Packaging News.
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Reclaim Your Factory's Future
Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability.
Nordson Electronic Solutions
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