| Sponsor |
|
Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
|
|
| Sponsor |
|
Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.
|
|
| Ask the Experts |
|
|
May 7, 2007 - Updated
July 4, 2007 - Originally Posted
Soldering wire on through-hole pad
Is there an IPC standard or other suggestion for soldering 18 gage wire "ON TOP" of a through-hole pad?
K.Z
|
| Expert Panel Responses |
Not sure if I wouild call it a standard, I think it may be more of a guideline. See some info at: http://www.circuitrework.com/guides/6-1.shtml
Jeff Ferry
President
Circuit Technology Center, Inc.
Mr. Ferry is President of Circuit Technology Center, a world-leading contractor for the repair and rework of assembled circuit boards founded in 1983. Jeff also serves as Publisher of Circuitnet and Semiconductor Packaging News.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
|
|
|