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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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| Ask the Experts |
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May 7, 2007 - Updated
July 4, 2007 - Originally Posted
Soldering wire on through-hole pad
Is there an IPC standard or other suggestion for soldering 18 gage wire "ON TOP" of a through-hole pad?
K.Z
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| Expert Panel Responses |
Not sure if I wouild call it a standard, I think it may be more of a guideline. See some info at: http://www.circuitrework.com/guides/6-1.shtml
Jeff Ferry
President
Circuit Technology Center, Inc.
Mr. Ferry is President of Circuit Technology Center, a world-leading contractor for the repair and rework of assembled circuit boards founded in 1983. Jeff also serves as Publisher of Circuitnet and Semiconductor Packaging News.
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AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
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