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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Ask the Experts Member |
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Avery Armes
IPC Training Coordinator
Adco Circuits Inc.
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Mr. Armes is the Training Coordinator at Adco Circuits Inc. he has 21 years experience in surface mount and through hole assembly, test and inspection, with a focus on IPC 7711/7722 repair/rework techniques. IPC-A-610 C.I.T., J-STD-001E C.I.T., J-STD-001ES C.I.T.
Avery Armes has submitted responses to the following questions.
Gold Edge Contact Rework
This is a great question. Most people use a pencil eraser to 'polish' the gold surface. It doesn't make it ...
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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