Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Avery Armes

IPC Training Coordinator

Adco Circuits Inc.

Mr. Armes is the Training Coordinator at Adco Circuits Inc. he has 21 years experience in surface mount and through hole assembly, test and inspection, with a focus on IPC 7711/7722 repair/rework techniques. IPC-A-610 C.I.T., J-STD-001E C.I.T., J-STD-001ES C.I.T.

Avery Armes has submitted responses to the following questions.

Gold Edge Contact Rework
This is a great question. Most people use a pencil eraser to 'polish' the gold surface. It doesn't make it ...

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling