Sponsor

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Ask the Experts Member

Simon G. Norman

International Director
EVS International

Simon G. Norman is the international director for EVS International, the Leader in Solder Recovery.

Simon G. Norman has submitted responses to the following questions.

Options for Reducing Dross
Hundreds of customers worldwide and many of the worlds large contract manufactures have found the best way to handle dross ...

Lead Free Dross Removal
Hundreds of customers worldwide have found the best way to handle dross on your wave is to mechanically recover the ...

Recover Solder from Dross
Does it make economic sense to develop an in-house capability for recovering pure solder from solder dross? This depends on ...

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Sponsor

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.