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Webinar on 10/30 at 11:00 AM PT
Free Webinar: Learn what's new in the IPC-6012 Space Addendum featuring key updates, best design practices, and reliability.
Summit Interconnect

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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Ask the Experts Member

Simon G. Norman

International Director
EVS International

Simon G. Norman is the international director for EVS International, the Leader in Solder Recovery.

Simon G. Norman has submitted responses to the following questions.

Options for Reducing Dross
Hundreds of customers worldwide and many of the worlds large contract manufactures have found the best way to handle dross ...

Lead Free Dross Removal
Hundreds of customers worldwide have found the best way to handle dross on your wave is to mechanically recover the ...

Recover Solder from Dross
Does it make economic sense to develop an in-house capability for recovering pure solder from solder dross? This depends on ...

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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS