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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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Simon G. Norman

Simon G. Norman

International Director
EVS International
Simon G. Norman is the international director for EVS International, the Leader in Solder Recovery.

Simon G. Norman has submitted responses to the following questions.
Options for Reducing Dross
Hundreds of customers worldwide and many of the worlds large contract manufactures have found the best way to handle dross ...
Lead Free Dross Removal
Hundreds of customers worldwide have found the best way to handle dross on your wave is to mechanically recover the ...
Recovering Solder from Dross
Does it make economic sense to develop an in-house capability for recovering pure solder from solder dross? This depends on ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling