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Master Bond
Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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UNDI Fabrication for IC Substrates
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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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Eddie Groves

Eddie Groves

Director of the Selective Soldering Academy (SSA)
Selective Soldering Academy
Eddie Groves has over 32 years' experience in the electronics manufacturing industry, specifically in the soldering of circuit boards. His first 11 years was with Lucent Technologies (AT&T), then with Kester, Qualitek and then Pillarhouse. He has over two decades of Selective Soldering experience as a user and a provider of Selective Soldering equipment. His particular focus is Process Development, Process Troubleshooting, flux, and component & PCB solderability.

Eddie Groves has submitted responses to the following questions.
Solder Joint Blow Holes
The epoxy bump on the bottom of the LED shouldn't cause a new blow hole problem just by changing from ...
Insufficient Barrel Fill on Through-hole Components
This could be a result of several things—from poor solderability of the lead/board due to contamination, the lead/board finish, or ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling