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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Eddie Groves
Director of the Selective Soldering Academy (SSA)
Selective Soldering Academy
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Eddie Groves has over 32 years' experience in the electronics manufacturing industry, specifically in the soldering of circuit boards. His first 11 years was with Lucent Technologies (AT&T), then with Kester, Qualitek and then Pillarhouse. He has over two decades of Selective Soldering experience as a user and a provider of Selective Soldering equipment. His particular focus is Process Development, Process Troubleshooting, flux, and component & PCB solderability.
Eddie Groves has submitted responses to the following questions.
Solder Joint Blow Holes
The epoxy bump on the bottom of the LED shouldn't cause a new blow hole problem just by changing from ...
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