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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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Ask the Experts Member |
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Eddie Groves
Director of the Selective Soldering Academy (SSA)
Selective Soldering Academy
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Eddie Groves has over 32 years' experience in the electronics manufacturing industry, specifically in the soldering of circuit boards. His first 11 years was with Lucent Technologies (AT&T), then with Kester, Qualitek and then Pillarhouse. He has over two decades of Selective Soldering experience as a user and a provider of Selective Soldering equipment. His particular focus is Process Development, Process Troubleshooting, flux, and component & PCB solderability.
Eddie Groves has submitted responses to the following questions.
Solder Joint Blow Holes
The epoxy bump on the bottom of the LED shouldn't cause a new blow hole problem just by changing from ...
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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