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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Ask the Experts Member |
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Eddie Groves
Director of the Selective Soldering Academy (SSA)
Selective Soldering Academy
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Eddie Groves has over 32 years' experience in the electronics manufacturing industry, specifically in the soldering of circuit boards. His first 11 years was with Lucent Technologies (AT&T), then with Kester, Qualitek and then Pillarhouse. He has over two decades of Selective Soldering experience as a user and a provider of Selective Soldering equipment. His particular focus is Process Development, Process Troubleshooting, flux, and component & PCB solderability.
Eddie Groves has submitted responses to the following questions.
Solder Joint Blow Holes
The epoxy bump on the bottom of the LED shouldn't cause a new blow hole problem just by changing from ...
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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