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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Jim Hevel

Research Chemist

Indium Corporation of America

Jim is a Research Chemist at Indium Corporation of America with 30 years of experience in wave flux product development.

Jim Hevel has submitted responses to the following questions.

OA Flux Turning Blue
1. Soldering fluxes are intended to react with metallic surfaces to facilitate soldering. OA fluxes react much faster and more ...

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling