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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Ask the Experts Member |
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Jim Hevel
Research Chemist
Indium Corporation of America
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Jim is a Research Chemist at Indium Corporation of America with 30 years of experience in wave flux product development.
Jim Hevel has submitted responses to the following questions.
OA Flux Turning Blue
1. Soldering fluxes are intended to react with metallic surfaces to facilitate soldering. OA fluxes react much faster and more ...
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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