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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
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Dr. Bill Cardoso
CEO
Creative Electron
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Founder and CEO of Creative Electron, the largest US manufacturer of x-ray machines for the electronics industry, Dr. Cardoso has over 20 years of experience in x-ray inspection. He's a frequent speaker at technical conferences, has over 120 published papers, and owns several patents in the field.
Dr. Bill Cardoso has submitted responses to the following questions.
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Thermally Conductive, Low Outgassing Epoxy
Master Bond EP21AOLV-2LO is an electrically insulating adhesive that meets NASA low outgassing requirements for sealing, coating and encapsulation applications. Ask an expert.
Master Bond
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