Sponsor

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

Sponsor

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Ask the Experts Member

Grant Peterson

Vice President; Marketing & Sales
ECD

Grant Peterson has 30+ years of professional experience including construction-management in the military, sales and operations management in display technologies, software and thermal process management technologies.
NOTE: Mr. Peterson is no longer working at ECD

Grant Peterson has submitted responses to the following questions.

Re-certify a reflow oven after moving
Good question. The fact that you're asking about the exhaust is encouraging, as oven fans and exhaust fans are common ...

Reflow oven testing and calibrating concern
Although there does not appear to be an official "industry" standard, there is a standard tool used by several Reflow ...

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Sponsor

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.