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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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Grant Peterson

Grant Peterson

Vice President; Marketing & Sales
ECD
Grant Peterson has 30+ years of professional experience including construction-management in the military, sales and operations management in display technologies, software and thermal process management technologies. NOTE: Mr. Peterson is no longer working at ECD

Grant Peterson has submitted responses to the following questions.
Reflow oven testing and calibrating concern
Although there does not appear to be an official "industry" standard, there is a standard tool used by several Reflow ...
Re-certify a reflow oven after moving
Good question. The fact that you're asking about the exhaust is encouraging, as oven fans and exhaust fans are common ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling