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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

Ask the Experts Member

Grant Peterson

Vice President; Marketing & Sales
ECD

Grant Peterson has 30+ years of professional experience including construction-management in the military, sales and operations management in display technologies, software and thermal process management technologies.
NOTE: Mr. Peterson is no longer working at ECD

Grant Peterson has submitted responses to the following questions.

Re-certify a reflow oven after moving
Good question. The fact that you're asking about the exhaust is encouraging, as oven fans and exhaust fans are common ...

Reflow oven testing and calibrating concern
Although there does not appear to be an official "industry" standard, there is a standard tool used by several Reflow ...

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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated