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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

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REL61: Cost-Effective Soldering, Elevated Performance
Many low/no-silver alternatives save money but fall short in performance. REL61 is different, offering both lower costs and better performance.
AIM Solder

Ask the Experts Member

Grant Peterson

Vice President; Marketing & Sales
ECD

Grant Peterson has 30+ years of professional experience including construction-management in the military, sales and operations management in display technologies, software and thermal process management technologies.
NOTE: Mr. Peterson is no longer working at ECD

Grant Peterson has submitted responses to the following questions.

Re-certify a reflow oven after moving
Good question. The fact that you're asking about the exhaust is encouraging, as oven fans and exhaust fans are common ...

Reflow oven testing and calibrating concern
Although there does not appear to be an official "industry" standard, there is a standard tool used by several Reflow ...

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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron