| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
| Sponsor |
|
Outsourcing: A Risk You Can't Afford
Stop risking delays, tariffs, and rising costs with overseas PCB assembly. Bring production in-house with Manncorp for speed, precision, and total control—future-secured.
Manncorp Inc.
|
|
Ask the Experts Member |
|
|
Michael Jawitz
Electronics Engineer Corporate PWB BDE
Boeing Research and Development
|
35 years in the electronics industry in design and fabrication of rigid, rigid flex and flexible pwbs. Corporate SME (DBE)on pwb design, fab and assembly.
Michael Jawitz has submitted responses to the following questions.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions
|
|
|