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Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Ask the Experts Member

Michael Jawitz

Electronics Engineer Corporate PWB BDE
Boeing Research and Development

35 years in the electronics industry in design and fabrication of rigid, rigid flex and flexible pwbs. Corporate SME (DBE)on pwb design, fab and assembly.

Michael Jawitz has submitted responses to the following questions.

Hand Soldering at Low Temperature
Anytime you are soldering a PWB there is a risk to both the parts and the circuit card. A lot ...

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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.