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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Michael Jawitz
Electronics Engineer Corporate PWB BDE
Boeing Research and Development
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35 years in the electronics industry in design and fabrication of rigid, rigid flex and flexible pwbs. Corporate SME (DBE)on pwb design, fab and assembly.
Michael Jawitz has submitted responses to the following questions.
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