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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

Ask the Experts Member

Michael Jawitz

Electronics Engineer Corporate PWB BDE
Boeing Research and Development

35 years in the electronics industry in design and fabrication of rigid, rigid flex and flexible pwbs. Corporate SME (DBE)on pwb design, fab and assembly.

Michael Jawitz has submitted responses to the following questions.

Hand Soldering at Low Temperature
Anytime you are soldering a PWB there is a risk to both the parts and the circuit card. A lot ...

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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated