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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Steve Cook

Steve Cook

Director of Product Technology
Techspray
Steve Cook is the Director of Product Technology at Techspray, a division of Illinois Tool Works (ITW) and a leading manufacturer of chemical products for the electronics industry.

Steve Cook has submitted responses to the following questions.
Uneven Conformal Coating
Is the same batch of conformal coating working on other boards? I not the product is faulty. If yes then ...
Exposed Leads on Conformally Coated Boards
I would recommend that you recoat the leads. When clipping the leads you could have damaged the conformal coating thereby ...
Circuit Board Exposed to Rain
I would say that your board is susceptible to early failure. Even thought the board was dried after exposure there ...
Devices for Soldering Iron Tip Cleaning
Soldering tips are often cleaned with tip cleaner or tinner. The majority of these cleaners are a semisolid mixture of ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
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The Essential Guide for High-Reliability BGA Component Re-balling