Sponsor

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

Sponsor

Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

Ask the Experts Member

Steve Cook

Director of Product Technology
Techspray

Steve Cook is the Director of Product Technology at Techspray, a division of Illinois Tool Works (ITW) and a leading manufacturer of chemical products for the electronics industry.

Steve Cook has submitted responses to the following questions.

Devices for Soldering Iron Tip Cleaning
Soldering tips are often cleaned with tip cleaner or tinner. The majority of these cleaners are a semisolid mixture of ...

Uneven Conformal Coating
Is the same batch of conformal coating working on other boards? I not the product is faulty. If yes then ...

Circuit Board Exposed to Rain
I would say that your board is susceptible to early failure. Even thought the board was dried after exposure there ...

Exposed Leads on Conformally Coated Boards
I would recommend that you recoat the leads. When clipping the leads you could have damaged the conformal coating thereby ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated