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AIT ORMET® TLPS for Proven Reliability
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Ask the Experts Member

Linda Woody

SME Production Technical Excellence Staff
Lockheed Martin

Subject matter expert in the field of electronics assembly and soldering.

Linda Woody has submitted responses to the following questions.

Tiny Solder Balls After Reflow
You may have moisture in your solder paste which is causing the solder balls to explode off during reflow. This ...

Un-cleaned PCB Assemblies Potted
If the flux was intended to be removed by a wash and was not then the consequences could severe. Many ...

Solder Paste Alloy Check
Use XRF (x-ray fluorescence) to look for Pb content. ...

What Causes Solder Balls During Rework?
This typically happens during hot gas rework when the coating is not removed far enough away from the nozzle. If ...

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AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
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