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Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
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UV-curable, low-modulus ruggedizing adhesives secure BGAs/VGAs, improving shock & vibration resistance of electronic assemblies. Low-outgassing version available.
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Ask the Experts Member

Linda Woody

SME Production Technical Excellence Staff
Lockheed Martin

Subject matter expert in the field of electronics assembly and soldering.

Linda Woody has submitted responses to the following questions.

Tiny Solder Balls After Reflow
You may have moisture in your solder paste which is causing the solder balls to explode off during reflow. This ...

Un-cleaned PCB Assemblies Potted
If the flux was intended to be removed by a wash and was not then the consequences could severe. Many ...

Solder Paste Alloy Check
Use XRF (x-ray fluorescence) to look for Pb content. ...

What Causes Solder Balls During Rework?
This typically happens during hot gas rework when the coating is not removed far enough away from the nozzle. If ...

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Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®.
Plasmatreat GmbH