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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

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Depaneling machine for separating circuit boards
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Ask the Experts Member

Linda Woody

SME Production Technical Excellence Staff
Lockheed Martin

Subject matter expert in the field of electronics assembly and soldering.

Linda Woody has submitted responses to the following questions.

Tiny Solder Balls After Reflow
You may have moisture in your solder paste which is causing the solder balls to explode off during reflow. This ...

Un-cleaned PCB Assemblies Potted
If the flux was intended to be removed by a wash and was not then the consequences could severe. Many ...

Solder Paste Alloy Check
Use XRF (x-ray fluorescence) to look for Pb content. ...

What Causes Solder Balls During Rework?
This typically happens during hot gas rework when the coating is not removed far enough away from the nozzle. If ...

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Is your PCB surface finish surviving the wash?
Aqueous cleaning can stain or strip ImSn, ImAg & ENIG finishes. Get test data on protecting surface finish integrity post-reflow.
ZESTRON Americas