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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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Expert

Linda Woody

SME Production Technical Excellence Staff
Lockheed Martin
Subject matter expert in the field of electronics assembly and soldering.

Linda Woody has submitted responses to the following questions.
Tiny Solder Balls After Reflow
You may have moisture in your solder paste which is causing the solder balls to explode off during reflow. This ...
Un-cleaned PCB Assemblies Potted
If the flux was intended to be removed by a wash and was not then the consequences could severe. Many ...
Solder Paste Alloy Check
Use XRF (x-ray fluorescence) to look for Pb content.
What Causes Solder Balls During Rework?
This typically happens during hot gas rework when the coating is not removed far enough away from the nozzle. If ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
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The Essential Guide for High-Reliability BGA Component Re-balling