Sponsor

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

Sponsor

Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

Ask the Experts Member

Linda Woody

SME Production Technical Excellence Staff
Lockheed Martin

Subject matter expert in the field of electronics assembly and soldering.

Linda Woody has submitted responses to the following questions.

Tiny Solder Balls After Reflow
You may have moisture in your solder paste which is causing the solder balls to explode off during reflow. This ...

Un-cleaned PCB Assemblies Potted
If the flux was intended to be removed by a wash and was not then the consequences could severe. Many ...

Solder Paste Alloy Check
Use XRF (x-ray fluorescence) to look for Pb content. ...

What Causes Solder Balls During Rework?
This typically happens during hot gas rework when the coating is not removed far enough away from the nozzle. If ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated