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The Most Effective Through Hole Rework
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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
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Expert

Linda Woody

SME Production Technical Excellence Staff
Lockheed Martin
Subject matter expert in the field of electronics assembly and soldering.

Linda Woody has submitted responses to the following questions.
Tiny Solder Balls After Reflow
You may have moisture in your solder paste which is causing the solder balls to explode off during reflow. This ...
Un-cleaned PCB Assemblies Potted
If the flux was intended to be removed by a wash and was not then the consequences could severe. Many ...
Solder Paste Alloy Check
Use XRF (x-ray fluorescence) to look for Pb content.
What Causes Solder Balls During Rework?
This typically happens during hot gas rework when the coating is not removed far enough away from the nozzle. If ...
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Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
Die Module Attach (static)