Guy Shemesh

General Manager

ePiccolo Engineering

Mr. Shemesh has Bsc. in E.E engineering and hands-on experience with electronics (schematics & layout) since 2004. He has designed dozens of multi-layer PCBs, HDI, RF, rigid-flex, etc., and had the honor for design reviewing veteran layout engineers several times as a consultant.

Guy Shemesh has submitted responses to the following questions.

D-PAK With Exposed Copper
Trimming a component must not be attempted. You are out of specs of the IC manufaturer, and the solder pads ...

3D AOI Solder Joint Qualification Parameters
The answer could be divided in two. First and foremost, I recommend looking at IPC-A-610 to verify that your suspected ...

Design Considerations and Impact on Assembly
Generally speaking, you should always strive to produce a board that is as simple as possible to manufacture and assemble. ...

Solder Joint Blow Holes
I don't think the root cause is with air tight sealing on the top although this can aggravate the problem ...

Removal of Non-functional Pads from Inner Layers
As a 15+ circuit designer, I can add that there are major advantages to having the non-functional pads removed. First ...