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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Ask the Experts Member |
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Gerald Gardener
Sales Manager
JBC Tools Inc
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With over 10 years experience in design and product development, I offer technical support to our US Sales force and liase with our Europe based R&D and manufacturing departments to continually offer the end user the best handsoldering solution possible.
Gerald Gardener has submitted responses to the following questions.
Hand Soldering Alternative
One option could be to use a solderingiron with an auto solder wire feeder like the JBC AL. This would ...
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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