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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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Ask the Experts Member |
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Gerald Gardener
Sales Manager
JBC Tools Inc
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With over 10 years experience in design and product development, I offer technical support to our US Sales force and liase with our Europe based R&D and manufacturing departments to continually offer the end user the best handsoldering solution possible.
Gerald Gardener has submitted responses to the following questions.
Hand Soldering Alternative
One option could be to use a solderingiron with an auto solder wire feeder like the JBC AL. This would ...
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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