Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Gerald Gardener

Sales Manager

JBC Tools Inc

With over 10 years experience in design and product development, I offer technical support to our US Sales force and liase with our Europe based R&D and manufacturing departments to continually offer the end user the best handsoldering solution possible.

Gerald Gardener has submitted responses to the following questions.

Hand Soldering Alternative
One option could be to use a solderingiron with an auto solder wire feeder like the JBC AL. This would ...

Problems Hand Soldering 24 Layer Board
The important thing is to have a top qualitytemperature controlled soldering iron that is able to maintain its tiptemperature. Then ...

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling