Amit Bahl

Amit Bahl has submitted responses to the following questions.

Design Specs for Selective Soldering
That depends on the component(s) being soldered. For bigger PTH components with bigger pins, we use bigger nozzle which requires ...

Coils Rotated After Reflow
There are 2 scenarios: The PCB soldering pads are much bigger than the component pins, which allowed the component to ...

Design Considerations and Impact on Assembly
The factors that affect PCB design include drill holes, annular ring, trace widths, spacing between the traces, power planes on ...

Matte Black Solder Mask Defects
Sticking of film is mainly due to improper tack dry process. To avoid this, the temperature profiling of the oven ...

Pin-in-Paste Hole Stencil Printing
Lacks info regarding the type of paste and the finished hole diameter but a vacuum plate to help pull the ...

Causes of Annular Ring Dewetting
The selective annular ring de-wetting (SAD) phenomenon occurs during Pb-wave soldering assembly and significantly affects the contact side of the ...

How to Remove Oxidization from SMT Component Leads?
Active flux can be applied to remove the oxide layer to achieve good soldering results. However, it is recommended to ...

Considering Plasma Cleaning
There is no down side. We can use plasma cleaning. ...

How To Measure Solder Paste Rolling Diameter
The rolling diameter of the solder paste should be 1 inch optimum. If it is more it will block the ...

Shelf Life Limit for Soldering Old Components
Active components, including semiconductors, oscillators, and diodes, etc., can be accepted, if less than 2 years old. They must pass ...

Tarnished OSP Circuit Boards
After OSP application, the panels must be dried immediately and all holes must be blown out to ensure no residual ...

Pad Missing ENIG Plating
If the pads were not plated because of the design of the board, then OSP is a good solution. Note ...