| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
| Sponsor |
|
Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
|
|
Ask the Experts Member |
|
|
Francois Monette
VP Sales & Marketing
Cogiscan
|
Mr. Monette is one of the co-founders of Cogiscan and leads global sales, business development and marketing. Since 1990, he has held a variety of positions in the electronics manufacturing industry, mostly focused on quality and process engineering.
Francois Monette has submitted responses to the following questions.
BGA Component Moisture Exposure
When overexposed Moisture-sensitive components go through the solder reflow cycle, the entrapped moisture will turn into steam which can cause ...
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
