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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Francois Monette

Francois Monette

VP Sales & Marketing
Cogiscan
Mr. Monette is one of the co-founders of Cogiscan and leads global sales, business development and marketing. Since 1990, he has held a variety of positions in the electronics manufacturing industry, mostly focused on quality and process engineering.

Francois Monette has submitted responses to the following questions.
BGA Component Moisture Exposure
When overexposed Moisture-sensitive components go through the solder reflow cycle, the entrapped moisture will turn into steam which can cause ...
Why Should We Consider Smart Feeders?
Smart feeders represent a very strategic investment. It provides significant benefits for a relatively small percentage in the overall price ...
RFID Technology for Pick and Place feeders
RFID technology is widely used for pick and place feeders. This technology is used to upgrade existing dumb feeders to ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling