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Your Partner for All Inspection Tasks
AOI from Viscom for the Best Cycle times and Maximum Inspection Depth. See 3D AXI, 3D AOI and 3D MXI at IPC APEX EXPO. Visit booth 2820. March 18-20.
Viscom

Sponsor

Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center

Ask the Experts Member

Francois Monette

VP Sales & Marketing
Cogiscan

Mr. Monette is one of the co-founders of Cogiscan and leads global sales, business development and marketing. Since 1990, he has held a variety of positions in the electronics manufacturing industry, mostly focused on quality and process engineering.

Francois Monette has submitted responses to the following questions.

BGA Component Moisture Exposure
When overexposed Moisture-sensitive components go through the solder reflow cycle, the entrapped moisture will turn into steam which can cause ...

Why Should We Consider Smart Feeders?
Smart feeders represent a very strategic investment. It provides significant benefits for a relatively small percentage in the overall price ...

RFID Technology for Pick and Place feeders
RFID technology is widely used for pick and place feeders. This technology is used to upgrade existing dumb feeders to ...

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Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder

TLPS is proven for outstanding reliabiility #2