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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

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Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more.
BEST Inc.

Ask the Experts Member

Francois Monette

VP Sales & Marketing
Cogiscan

Mr. Monette is one of the co-founders of Cogiscan and leads global sales, business development and marketing. Since 1990, he has held a variety of positions in the electronics manufacturing industry, mostly focused on quality and process engineering.

Francois Monette has submitted responses to the following questions.

BGA Component Moisture Exposure
When overexposed Moisture-sensitive components go through the solder reflow cycle, the entrapped moisture will turn into steam which can cause ...

RFID Technology for Pick and Place feeders
RFID technology is widely used for pick and place feeders. This technology is used to upgrade existing dumb feeders to ...

Why should we consider "smart feeders"?
Smart feeders represent a very strategic investment. It provides significant benefits for a relatively small percentage in the overall price ...

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SEHO@productronica: Innovations up close
Designed for demanding applications and focused on efficiency. Experience what is already possible today to make your production future-proof. Meet SEHO at productronica: A4-578!
SEHO