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AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
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Adhesives for Tomorrow's Electronics
Dymax UV/LED curable adhesives, dispensers & curing equipment provide bonding and protection solutions for PCBs and board-level components. Learn how!
Dymax
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Ask the Experts Member |
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Francois Monette
VP Sales & Marketing
Cogiscan
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Mr. Monette is one of the co-founders of Cogiscan and leads global sales, business development and marketing. Since 1990, he has held a variety of positions in the electronics manufacturing industry, mostly focused on quality and process engineering.
Francois Monette has submitted responses to the following questions.
BGA Component Moisture Exposure
When overexposed Moisture-sensitive components go through the solder reflow cycle, the entrapped moisture will turn into steam which can cause ...
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Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
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