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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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Ask the Experts Member |
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Al Bousetta
Director of Marketing
Nordson March
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Al holds a doctorate in joint physics and electrical engineering from the University of Manchester (UMIST) and has worked in semiconductor process and applications for more than 25 years. Al is the author of more than 30 technical papers.
Al Bousetta has submitted responses to the following questions.
Considering Plasma Cleaning
Underfill performance of the flip chip packaging only relies on the surface characteristics of the die and the substrate. Plasma ...
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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