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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Sponsor

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom SE

Ask the Experts Member

Al Bousetta

Director of Marketing
Nordson March

Al holds a doctorate in joint physics and electrical engineering from the University of Manchester (UMIST) and has worked in semiconductor process and applications for more than 25 years. Al is the author of more than 30 technical papers.

Al Bousetta has submitted responses to the following questions.

How to Remove Oxidization from SMT Component Leads?
If the root cause of the oxidation is long-term storage, then the proactive step is to prevent oxidation from happening ...

Considering Plasma Cleaning
Underfill performance of the flip chip packaging only relies on the surface characteristics of the die and the substrate. Plasma ...

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Sponsor

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas