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Viscom
iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
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Al Bousetta

Al Bousetta

Director of Marketing
Nordson March
Al holds a doctorate in joint physics and electrical engineering from the University of Manchester (UMIST) and has worked in semiconductor process and applications for more than 25 years. Al is the author of more than 30 technical papers.

Al Bousetta has submitted responses to the following questions.
How to Remove Oxidization from SMT Component Leads?
If the root cause of the oxidation is long-term storage, then the proactive step is to prevent oxidation from happening ...
Considering Plasma Cleaning
Underfill performance of the flip chip packaging only relies on the surface characteristics of the die and the substrate. Plasma ...
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Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
Die Module Attach (static)