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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

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Depaneling machine for separating circuit boards
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Ask the Experts Member

Al Bousetta

Director of Marketing
Nordson March

Al holds a doctorate in joint physics and electrical engineering from the University of Manchester (UMIST) and has worked in semiconductor process and applications for more than 25 years. Al is the author of more than 30 technical papers.

Al Bousetta has submitted responses to the following questions.

How to Remove Oxidization from SMT Component Leads?
If the root cause of the oxidation is long-term storage, then the proactive step is to prevent oxidation from happening ...

Considering Plasma Cleaning
Underfill performance of the flip chip packaging only relies on the surface characteristics of the die and the substrate. Plasma ...

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Is your PCB surface finish surviving the wash?
Aqueous cleaning can stain or strip ImSn, ImAg & ENIG finishes. Get test data on protecting surface finish integrity post-reflow.
ZESTRON Americas