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Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch

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Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center

Ask the Experts Member

Al Bousetta

Director of Marketing
Nordson March

Al holds a doctorate in joint physics and electrical engineering from the University of Manchester (UMIST) and has worked in semiconductor process and applications for more than 25 years. Al is the author of more than 30 technical papers.

Al Bousetta has submitted responses to the following questions.

How to Remove Oxidization from SMT Component Leads?
If the root cause of the oxidation is long-term storage, then the proactive step is to prevent oxidation from happening ...

Considering Plasma Cleaning
Underfill performance of the flip chip packaging only relies on the surface characteristics of the die and the substrate. Plasma ...

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp