circuitnet
Sponsor
Ormet TLPS
AIT ORMETĀ® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Advanced Plating Tool
Sponsor
Essegi Automation
Automated Storage for High-Mix EMS Production
High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows and reel-level visibility.
Essegi Automation
Ask the Experts Member
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
Al Bousetta

Al Bousetta

Director of Marketing
Nordson March
Al holds a doctorate in joint physics and electrical engineering from the University of Manchester (UMIST) and has worked in semiconductor process and applications for more than 25 years. Al is the author of more than 30 technical papers.

Al Bousetta has submitted responses to the following questions.
How to Remove Oxidization from SMT Component Leads?
If the root cause of the oxidation is long-term storage, then the proactive step is to prevent oxidation from happening ...
Considering Plasma Cleaning
Underfill performance of the flip chip packaging only relies on the surface characteristics of the die and the substrate. Plasma ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Circuitnet Media LLC
Reflow Soldering Oven Survey
We invite you to participate in this important survey about Reflow Soldering Ovens. This survey is anonymous, and your personal data is not collected. Click to begin survey.
Circuitnet Media LLC
Trusted Partner for Mission-Critical PCBs