Sponsor

actnano Materials with Nordson Equipment
actnano's PFAS-free, cure-free coatings save energy and boost safety. And they are compatible with Nordson conformal coating systems. Upgrade your system today. Learn more!
Nordson Electronic Solutions

Sponsor

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology

Ask the Experts Member

Mahendra Gandhi

SME - PWB Technologies

Northrop Grumman

Mahendra Gandhi has been working in interconnect industry since 1972.

Mahendra Gandhi has submitted responses to the following questions.

Exposed Copper Risk
Yes!

How to Eliminate Via Pits
Solder paste are not designed/developed as a via fill materials and should not be used as a via fill.

Flux Oozing from Insulated Wires
Capillary action during first tinning.

Conformal Coating in Low Humidity Environments
Not if it is fully cured.

Gold Plated Hole Defects
Have the board fabricated with solder coating in the holes... and avoid removing gold from the holes.

HASL vs. Immersion Gold
Do you recommend use of HASL vs. immersion gold for our application? Yes. Would you recommend another type of finish? ...

Improve DPPM for Wave Soldering Using Nitrogen
Itwill improve but not eliminate.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Low Pressure Plasma for Electronics
Expand your knowledge of plasma technology. Register now for the new PlasmaTalk webinar to learn how low-pressure plasma can advance your production.
Plasmatreat