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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

Ask the Experts Member

Mahendra Gandhi

SME - PWB Technologies
Northrop Grumman

Mahendra Gandhi has been working in interconnect industry since 1972.

Mahendra Gandhi has submitted responses to the following questions.

Exposed Copper Risk
Yes! ...

How to Eliminate Via Pits
Solder paste are not designed/developed as a via fill materials and should not be used as a via fill. ...

Improve DPPM for Wave Soldering Using Nitrogen
Itwill improve but not eliminate. ...

Conformal Coating in Low Humidity Environments
Not if it is fully cured. ...

Flux Oozing from Insulated Wires
Capillary action during first tinning. ...

Gold Plated Hole Defects
Have the board fabricated with solder coating in the holes... and avoid removing gold from the holes. ...

HASL vs. Immersion Gold
Do you recommend use of HASL vs. immersion gold for our application? Yes. Would you recommend another type of finish? ...

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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS