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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
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Ask the Experts Member |
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Demetrius Chrysostomou
Director of Technology
PVA TePla
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Demetri has been the Director of Technology for PVA TePla America since Oct 2004. Graduating from Trinity College, Ireland with a PhD in Surface Chemistry, he continued his research at UC Riverside as a Post Doctorate Research Fellow. In 2000 Demetri joined MetroLine Industries, a gas plasma equipment manufacturer in California, as a Process Engineer. In 2001 he took up a similar position with TePla AG in Munich, Germany, focusing on plasma applications in advanced chip packaging and flat panel displays. Demetri now focuses on the development of plasma surface modification processes for the Semiconductor, Device Packaging and life science industries.
Demetrius Chrysostomou has submitted responses to the following questions.
Problems With Large Voids
Poor "wetting" of the potting material is common, particularly to low surface energy polymers. This can result in poor bonding ...
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