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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Ask the Experts Member |
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Demetrius Chrysostomou
Director of Technology
PVA TePla
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Demetri has been the Director of Technology for PVA TePla America since Oct 2004. Graduating from Trinity College, Ireland with a PhD in Surface Chemistry, he continued his research at UC Riverside as a Post Doctorate Research Fellow. In 2000 Demetri joined MetroLine Industries, a gas plasma equipment manufacturer in California, as a Process Engineer. In 2001 he took up a similar position with TePla AG in Munich, Germany, focusing on plasma applications in advanced chip packaging and flat panel displays. Demetri now focuses on the development of plasma surface modification processes for the Semiconductor, Device Packaging and life science industries.
Demetrius Chrysostomou has submitted responses to the following questions.
Problems With Large Voids
Poor "wetting" of the potting material is common, particularly to low surface energy polymers. This can result in poor bonding ...
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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