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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Demetrius Chrysostomou
Director of Technology
PVA TePla
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Demetri has been the Director of Technology for PVA TePla America since Oct 2004. Graduating from Trinity College, Ireland with a PhD in Surface Chemistry, he continued his research at UC Riverside as a Post Doctorate Research Fellow. In 2000 Demetri joined MetroLine Industries, a gas plasma equipment manufacturer in California, as a Process Engineer. In 2001 he took up a similar position with TePla AG in Munich, Germany, focusing on plasma applications in advanced chip packaging and flat panel displays. Demetri now focuses on the development of plasma surface modification processes for the Semiconductor, Device Packaging and life science industries.
Demetrius Chrysostomou has submitted responses to the following questions.
Problems With Large Voids
Poor "wetting" of the potting material is common, particularly to low surface energy polymers. This can result in poor bonding ...
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